Equipment for a Laboratory Course on Mechanical Reliability of Microelectronic Devices

为了实现超大规模集成，半导体器件技术正在经历快速变化。 对更复杂的芯片功能和更高速度的日益增长的需求导致了器件特征尺寸的减小。 随着微电子器件的不断小型化，微电子器件机械可靠性的新概念和新理论的发展已成为一个新兴的交叉学科。 该项目为格鲁吉亚理工学院高年级工程本科生提供微电子机械可靠性实验室课程设备。 为机械工程专业的学生开设这门课程的目的是（1）向他们介绍微电子的机械可靠性领域，（2）让他们意识到电子工业迫切需要包装机械工程师，（3）让他们在工程职业生涯中领先一步，以便他们能够面对21世纪世纪的技术挑战。 新设备包括一个显微测试系统和一个光学显微镜系统。

Semiconductor device technology is going through rapid changes in order to achieve ultra-large-scale integration. The increasing demand for more complex chip functionality and higher speed have led to decreasing device feature size. Development of new concepts and theories of mechanical reliability of microelectronic devices has been an emerging interdisciplinary subject because of the continual downsizing of the microelectronics devices. This project funds equipment for a laboratopy course on Mechanical Reliability of Microelectronics to be offered to upper-division engineering undergraduate students at Georgia Tech. The objectives of offering such a course to mechanical engineering students are (1) to introduce them to the field of mechanical reliability of microelectronics, (2) to make them aware that there is an urgent need in the electronic industry for mechanical engineers in packaging, and (3) to give them a head start in their engineering careers so they can face technological challenges in the 21st century. The new equipment includes a microtester system and an optical microscopy system.