An Interdisciplinary Undergraduate Laboratory for the Designand Manufacture of Surface Mount Printed Circuit Assemblies

表面贴装印刷电路组件设计与制造跨学科本科实验室

• 批准号: 9551283
• 负责人: Maher Rizkalla
• 金额: $ 4.47万
• 依托单位: Indiana University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1995
• 资助国家: 美国
• 起止时间: 1995-08-01 至 1998-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9551283&HistoricalAwards=false
• 关键词: Interdisciplinary; Undergraduate; Laboratory; Designand; Manufacture

This project is developing a state-of-the-art, interdisciplinary undergraduate laboratory component for an existing three-credit course, "Design and Manufacture of Printed Circuit Assemblies." Previously, student hands-on experiences had been limited to simulations with APTOS software, without a more meaningful laboratory experience needed for students to be better prepared for careers in this area. The course, with its new lab component, is intended for seniors in electrical engineering and mechanical engineering, and design projects are formulated so that students are able to focus on aspects that are commensurate with their major. Students fabricate their designs immediately at the Electronic Manufacturing Productivity Facility and test and evaluate their products in the new laboratory. Major equipment purchased for this laboratory includes six Sun SPARCstations, a networkable PADS-PERFORM CAD system for UNIX-based workstations, and a color plotter. This equipment is used for the layout design and analysis of surface mount printed circuit assemblies. Additional equipment includes two function generators, two digital storage oscilloscopes, and two logic analyzers used for testing the final products. This project is significant because it brings the theoretical study, laboratory design, and real product manufacturing of surface-mount printed circuit assemblies as a whole to undergraduate education. In addition, it provides a model for the cooperation of educational institutions and manufacturing companies to provide state-of-the-art technical training for senior students, and emphasizes interdisciplinary group work for students from different disciplines.

该项目正在为现有的三学分课程“印刷电路组件的设计和制造”开发一个最先进的、跨学科的本科生实验室组件。以前，学生的动手体验仅限于使用Aptos软件进行模拟，而没有更有意义的实验室体验，以便学生为这一领域的职业生涯做好更好的准备。这门课程包括新的实验部分，面向电气工程和机械工程专业的大四学生，设计项目的制定是为了让学生能够专注于与他们的专业相称的方面。学生们立即在电子制造生产力设施中制造他们的设计，并在新的实验室中测试和评估他们的产品。为该实验室购买的主要设备包括六台Sun SPAC工作站、一台用于基于Unix的工作站的可联网PADS-Performance CAD系统和一台彩色绘图仪。该设备用于表面贴装印刷电路组件的版图设计和分析。其他设备包括两个函数发生器、两个数字存储示波器和两个用于测试最终产品的逻辑分析仪。该项目将表面贴装印刷电路组件的理论研究、实验室设计和实际产品制造作为一个整体带到本科教育中，具有重要的意义。此外，它还为教育机构和制造公司的合作提供了一个模式，为高年级学生提供最先进的技术培训，并强调为来自不同学科的学生提供跨学科的小组工作。