SBIR PHASE I: Integrated Motoring and Magnetic Suspension System

SBIR 第一阶段：集成驱动和磁悬浮系统

• 批准号: 9561772
• 负责人: James Goldie
• 金额: $ 7.47万
• 依托单位: SATCON TECHNOLOGY CORPORATION
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1996
• 资助国家: 美国
• 起止时间: 1996-03-01 至 1996-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9561772&HistoricalAwards=false
• 关键词: SBIR; PHASE; Integrated; Motoring; Magnetic

This Small Business Innovation Research (SBIR) Phase I project will explore the use of advanced electromagnetic suspension and actuation technology to improve silicon wafer handling during Rapid Thermal Processing (RTP). Current wafer RTP processing incurs substantial cost from lost wafers and facility downtime due to ball bearing failure and wear. In addition to improved RTP equipment, manufacturers of wafer processing equipment need advanced facilities, which will make rolling element bearing technology obsolescent. Advances are expected in higher rotation rates and larger diameter wafers. Magnetic suspension and actuation technology looks promising for supporting and rotating a wafer in the high temperature corrosive atmosphere (fluorine, chlorine, HCl) used in RTP. Phase I will combine design, analysis, prototype testing, and cost/per-formance trade-offs to demonstrate feasibility and to produce a cost competitive conceptual design for an integrated motoring and magnetic suspension system (IMMSS) for RTP facilities. A prototype would be evaluated Phase II. Magnetic suspension and actuation technology is ultimately applicable to a wide range of material handling problems in integrated circuit manufacture which require precise positioning; the absence of stiction; the absence of wear particle generation; and exposure to vacuum, corrosive, or high temperature environments.

这个小企业创新研究（SBIR）第一阶段项目将探索使用先进的电磁悬浮和驱动技术来改善快速热处理（RTP）过程中的硅片处理。目前的晶圆RTP工艺由于滚珠轴承故障和磨损而造成晶圆损失和设备停机，造成了巨大的成本。除了改进的RTP设备外，晶圆加工设备制造商需要先进的设施，这将使滚动元件轴承技术过时。更高的旋转速率和更大直径的晶圆有望取得进展。在RTP中使用的高温腐蚀性大气（氟、氯、HCl）中，磁悬浮和驱动技术支持和旋转晶圆是很有前途的。第一阶段将结合设计、分析、原型测试和成本/性能权衡，以证明可行性，并为RTP设施的集成电机和磁悬浮系统（IMMSS）提供具有成本竞争力的概念设计。原型将在第二阶段进行评估。磁悬浮和驱动技术最终适用于集成电路制造中需要精确定位的各种物料搬运问题；无约束：没有约束；无磨损颗粒产生；暴露于真空、腐蚀性或高温环境中。