Passive and Active Thin Film Strain Sensors for Earthquake Damage Assessment

967265欧拉这个研究项目涉及到新型薄膜应变计的开发。将使用三种方法。第一种采用宽带隙半导体作为应变计中的有源传感元件，其中可以使用电阻率和吸收光谱来监测应变。这些材料很有吸引力，因为它们具有良好的重复性、长期的环境和传感器稳定性以及较大的测量系数。第二种方法将使用聚合物作为传感元件。这些材料的光学响应对应变也很敏感，有可能导致廉价的商品级有源应变元件。最后，将开发新的聚合物来存储随时间积累的应变，并可用于测量对基材的累积损伤。这方面研究的发展依赖于使用在项目初始阶段开发的光学方法方便地监测应变响应的能力，例如在地震、风或车辆引起的结构振动期间。这项研究的成功结果将导致更便宜的应变计，由于其薄膜性质，可以应用于建筑和基础设施材料，以监测应变并在地震等灾难性事件中评估损失。***

967265 Euler This research project is concerned with the development of new thin film strain gages. Three approaches will be used. The first employs wide band gap semiconductors as the active sensing element in a strain gage where both resistivity and absorption spectroscopy can be used to monitor the strain. These materials are attractive because they have good reproductivity, long term environmental and sensor stability, and large gage factors. The second approach will use polymers as the sensing element. The optical response of these materials is also sensitive to strain with the potential to lead to inexpensive, commodity level active strain elements. Finally, new polymers will be developed that store the integrated strain over time and can be used to measure accumulated damage to the substrate. The development of this aspect of the research relies on the ability to monitor the strain response conveniently such as during earthquake, wind, or vehicle induced structural vibrations using the optical methodology developed in the initial stages of the project. A successful outcome to the research will lead to cheaper strain gages that, because of the thin film nature, can be applied to buildings and infrastructure materials to monitor the strain and to assess the damage during a catastrophic event such as an earthquake. ***