SBIR Phase I: Development of Multilayer Ceramic Capacitors Through Microfabrication by Coextrusion Melt Spinning

*9660898希尔马这个第一阶段小型企业创新研究项目将使用一种新的方法来制造具有薄介质层的多层陶瓷电容器(MLCC)。MLCC将通过采用目前正在开发的低成本纤维整体(FM)加工技术来制造，以生产先进的结构陶瓷。它以热塑性塑料/粉末共混物的熔融纺丝为基础，创建了有利于陶瓷行业的新型分层结构。该项目将分别加入BaTiO和银基粉末作为介质材料和电极材料，以制备“原位”MLCC。将对这些原型MLCC进行微结构表征和电气测试，以证明整体概念的可行性。第一阶段的成功将允许未来的迭代，以优化所需的电气性能。对具有高容量和高体积效率的多层陶瓷电容器的需求增加了制造多层陶瓷电容器的挑战。在美国和日本，提高MLCC性能的首选方法是将介质陶瓷层的厚度减少到10m以下，同时保持高介电常数。这对目前的MLCC制造方法提出了一些关键的挑战，如流延，以满足这些需求。FM加工技术从先进的结构陶瓷成功地适应于功能性MLCC材料，将使后者能够以低成本制造，具有多种架构，并包含一系列选择的介电层厚度。这一新工艺的优化将使MLCC的产量超过现有的制造方法。***

*** 9660898 Hilmas This Phase I Small Business Innovation Research project will use a novel approach to fabricate multilayer ceramic capacitors (MLCCs) having thin dielectric layers. The MLCCs will be fabricated through an adaptation of the low cost Fibrous Monolithic (FM) processing technology, currently under development by the proposer, to produce advanced structural ceramics. It is based on the melt spinning of thermoplastic/powder blends to create novel hierarchical architectures beneficial to the ceramic industry. The project will incorporate BaTiOs and Ag-based powders as the dielectric and electrode materials, respectively, to fabricate 'in-situ' MLCCs. Microstructural characterization and electrical testing of these prototype MLCCs will be performed to demonstrate the feasibility of the overall concept. Phase I success will allow future iterations in order to optimize the desired electrical properties. The demand for multilayer ceramic capacitors having high capacitance and high volumetric efficiencies has led to increased challenges in the manufacturing of MLCCs. The preferred method for increasing the performance of MLCCs, both in the U.S. and Japan, is to reduce the thickness of the dielectric ceramic layers below 10 m while maintaining a high dielectric constant. This has posed some critical challenges to current MLCC fabrication methods, such as tape casting, in order to meet these needs. The successful adaptation of the FM processing technology from advanced structural ceramics to functional MLCC materials will allow the manufacturing of the latter at a low cost with a variety of architectures and incorporating a selection of dielectric layer thicknesses. The optimization of this novel process will lead to higher volume MLCC production over current fabrication methods. ***