SBIR Phase I: Development of Multilayer Ceramic Capacitors Through Microfabrication by Coextrusion Melt Spinning

SBIR 第一阶段：通过共挤熔融旋压微加工开发多层陶瓷电容器

• 批准号: 9660898
• 负责人: Gregory Hilmas
• 金额: $ 7.5万
• 依托单位: Sensintel Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-01-01 至 1997-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9660898&HistoricalAwards=false
• 关键词: SBIR; Phase; Development; Multilayer; Ceramic

*** 9660898 Hilmas This Phase I Small Business Innovation Research project will use a novel approach to fabricate multilayer ceramic capacitors (MLCCs) having thin dielectric layers. The MLCCs will be fabricated through an adaptation of the low cost Fibrous Monolithic (FM) processing technology, currently under development by the proposer, to produce advanced structural ceramics. It is based on the melt spinning of thermoplastic/powder blends to create novel hierarchical architectures beneficial to the ceramic industry. The project will incorporate BaTiOs and Ag-based powders as the dielectric and electrode materials, respectively, to fabricate 'in-situ' MLCCs. Microstructural characterization and electrical testing of these prototype MLCCs will be performed to demonstrate the feasibility of the overall concept. Phase I success will allow future iterations in order to optimize the desired electrical properties. The demand for multilayer ceramic capacitors having high capacitance and high volumetric efficiencies has led to increased challenges in the manufacturing of MLCCs. The preferred method for increasing the performance of MLCCs, both in the U.S. and Japan, is to reduce the thickness of the dielectric ceramic layers below 10 m while maintaining a high dielectric constant. This has posed some critical challenges to current MLCC fabrication methods, such as tape casting, in order to meet these needs. The successful adaptation of the FM processing technology from advanced structural ceramics to functional MLCC materials will allow the manufacturing of the latter at a low cost with a variety of architectures and incorporating a selection of dielectric layer thicknesses. The optimization of this novel process will lead to higher volume MLCC production over current fabrication methods. ***

* 9660898 Hilmas 该第一阶段小企业创新研究项目将使用一种新的方法来制造具有薄介电层的多层陶瓷电容器（MLCC）。MLCC将通过低成本纤维单片（FM）加工技术的适应来制造，该技术目前正在由提议者开发，以生产先进的结构陶瓷。它基于热塑性塑料/粉末共混物的熔融纺丝，以创造有利于陶瓷工业的新型分层结构。该项目将分别采用BaTiO和Ag基粉末作为电介质和电极材料，以制造“原位”MLCC。将对这些原型MLCC进行微结构表征和电气测试，以证明整体概念的可行性。第一阶段的成功将允许未来的迭代，以优化所需的电气性能。对具有高电容和高体积效率的多层陶瓷电容器的需求已经导致MLCC的制造中的增加的挑战。在美国和日本，提高MLCC性能的优选方法是将介电陶瓷层的厚度减小到10 μ m以下，同时保持高介电常数。为了满足这些需求，这对当前的MLCC制造方法（例如流延成型）提出了一些关键挑战。 FM处理技术从先进的结构陶瓷到功能MLCC材料的成功适应将允许以低成本制造具有各种架构的功能MLCC材料，并结合选择的电介质层厚度。 这种新工艺的优化将导致MLCC产量超过目前的制造方法。 ***