GOALI: Advanced Process Control Techniques for Large-Area Extrusion Coating

ECS-9708631 Kamen 在这项提案中，格鲁吉亚理工学院（格鲁吉亚理工学院）和FAStar有限公司（FAS）将合作推进用于集成电路、平板显示器、多芯片模块和太阳能电池的大面积基板的聚合物沉积技术。 将在挤出涂覆过程控制方面取得进展，其工作效果是通过将FAS的沉积技术应用于微电子制造来提高沉积工具的性能，并通过废物最小化来显着降低聚合物材料的成本。 聚合物沉积不仅对集成电路的制造至关重要，而且在每个电路的制造中重复多次。 旋涂是当今工业中用于将聚合物存款到微电子衬底上的最普遍的方法。 随着工业增加衬底尺寸，每个电路的成本降低，因为每次处理衬底时制造更多的电路。 然而，旋转大基板受到旋转惯性、涂层均匀性以及材料损失的挑战。 工具供应商已经开发并最近开始销售替代涂层方法。这些沉积方法包括帘式涂布、弯月面涂布和挤出涂布。 工艺控制的改进是这些新的、低单位成本的生产方法被微电子工业所接受和利用的一个至关重要的需求。

ECS-9708631 Kamen In this proposal, The Georgia Institute of Technology (Georgia Tech) and FAStar, Ltd. (FAS) will collaborate to advance polymer deposition technology for large area substrates used in integrated circuits, flat panel displays, multichip modules and solar cells. The advances will be made in extrusion coating process control with the effect of the work being to enhance the performance of the deposition tool and significantly reduce the cost of polymer material through waste minimization by applying FAS's deposition technique to microelectronics fabrication. Polymer deposition is not only essential to the manufacture of integrated circuits, it is repeated many times in the making of each circuit. Spin coating is the most prevalent method used in industry today to deposit polymers onto microelectronic substrates. As the industry increases substrate size, the cost of each circuit decreases because more circuits are fabricated each time a substrate is processed. However, spinning large substrates is challenged by rotational inertia, coating uniformity and again material loss. Tool vendors have developed and recently begun to market alternative coating methods. These deposition methods include curtain coating, meniscus coating and extrusion coating. Process control improvements are a vital need for these new, low per-unit cost production methods to be accepted and utilized by the microelectronic industry.