SBIR Phase I: Micro-Sensor Module for Seismic and Infrastructure Monitoring

这个小企业创新研究第一阶段项目将涉及开发一种基于微机械加速度计的微传感器模块，用于地震测试和基础设施监测应用，范围从地震研究到主动结构控制。该模块的核心将是一组微型、廉价、低功耗的加速度计。内置串行总线和无线通信能力将包括在内。集成微仪器公司由美国国防部高级研究计划局（darpa）资助的伯克利传感器和执行器中心（BSAC）设计团队组成，该团队生产了第一批集成微加速度计。这项工作产生了一个中等性能的微传感器模块，在一个缩略图大小的硅芯片上进行信号处理。这些经过验证的传感器架构将与BSAC开发的深沟微加工技术相结合。极厚的结构将大大提高灵敏度，从而提高性能。集成电路与这些传感器将允许温度补偿，滤波，特殊的小型化和数字输出。第一阶段的目标是证明微加工可以生产具有地震和基础设施监测所需性能的传感器和传感器系统。完整的机械传感器和电路设计将验证可行性，并允许在第二阶段快速制造功能设备。市场研究公司预测，到2000年，廉价的微型机械惯性传感器将占据超过10亿美元的市场，单位销售额将达到数千万。大量的商业应用，如汽车安全、虚拟现实、3-D电脑鼠标和机器监控，已经包含了微型传感器，使用这种技术可以大大改进。高性能微型传感器有望开辟新的领域，如增强GPS导航、通用航空、机器人和平台调平。风险资本家和一个军事承包商甚至接触了集成微仪器公司，继续保持着很高的商业兴趣。＊＊＊

*** 9760647 Clark This Small Business Innovation Research Phase I project will involve development of a micromachined-accelerometer based Micro-Sensor Module for use in seismic testing and infrastructure monitoring applications ranging from earthquake studies to active structure control. The heart of the module will be a triad of miniature, inexpensive, low-power accelerometers. Built-in serial bus and wireless communication capability will be included. Integrated Micro Instruments was formed from the core DARPA-sponsored Berkeley Sensor & Actuator Center (BSAC) design team which produced some of the first integrated microaccelerometers. This work has resulted in a medium performance micro-sensor module with signal processing on a thumbnail sized silicon chip. These proven sensor architectures will be combined with a deep trench micromachining technology developed at BSAC. The extremely thick structures will dramatically increase sensitivity and hence improve performance. Integrating circuits with these sensors will allow temperature compensation, filtering, exceptional miniaturization, and digital output. The goal of Phase I is to prove that micromachining can produce sensors and sensor systems with the performance required for seismic and infrastructure monitoring. Complete mechanical sensor and electrical circuit design will verify feasibility and allow rapid fabrication of functional devices in Phase II. Market research firms forecast inexpensive, micromachined inertial sensors to command a market of over one billion dollars with unit sales in the tens of millions by the year 2000. High volume commercial applications such as automotive safety, virtual reality, 3-D computer mice, and machine monitoring already incorporate miniature sensors which can be vastly improved using this technology. The high performance micro-sensors envisioned open new frontiers such as augmented GPS navigation, general aviation, robotics, and platform leveling. Integrated Micro Instruments has be en approached by venture capitalists and a military contractor continuing the very high level of commercial interest. ***