SBIR Phase I: Micro-Sensor Module for Seismic and Infrastructure Monitoring

*** 9760647 Clark 这个小型企业创新研究第一阶段项目将涉及开发基于微机械加速度计的微传感器模块，用于地震测试和基础设施监测应用，从地震研究到主动结构控制。 该模块的核心是微型、廉价、低功耗的加速计。 将包括内置串行总线和无线通信功能。 Integrated Micro Instruments 由 DARPA 赞助的伯克利传感器与执行器中心 (BSAC) 核心设计团队组成，该团队生产了一些第一批集成微加速度计。 这项工作产生了一种中等性能的微传感器模块，在缩略图大小的硅芯片上进行信号处理。 这些经过验证的传感器架构将与 BSAC 开发的深沟槽微加工技术相结合。 极厚的结构将显着提高灵敏度，从而提高性能。 与这些传感器集成的电路将实现温度补偿、滤波、卓越的小型化和数字输出。 第一阶段的目标是证明微机械加工可以生产具有地震和基础设施监测所需性能的传感器和传感器系统。 完整的机械传感器和电路设计将验证可行性并允许在第二阶段快速制造功能器件。 市场研究公司预测，到 2000 年，廉价的微机械惯性传感器将占据超过 10 亿美元的市场，销量将达到数千万。汽车安全、虚拟现实、3D 计算机鼠标和机器监控等大批量商业应用已经采用了微型传感器，使用该技术可以大大改进这些传感器。 高性能微型传感器设想了增强型 GPS 导航、通用航空、机器人和平台调平等新领域。 Integrated Micro Instruments 已受到风险投资家和军事承包商的青睐，并继续保持着很高的商业兴趣。 ***

*** 9760647 Clark This Small Business Innovation Research Phase I project will involve development of a micromachined-accelerometer based Micro-Sensor Module for use in seismic testing and infrastructure monitoring applications ranging from earthquake studies to active structure control. The heart of the module will be a triad of miniature, inexpensive, low-power accelerometers. Built-in serial bus and wireless communication capability will be included. Integrated Micro Instruments was formed from the core DARPA-sponsored Berkeley Sensor & Actuator Center (BSAC) design team which produced some of the first integrated microaccelerometers. This work has resulted in a medium performance micro-sensor module with signal processing on a thumbnail sized silicon chip. These proven sensor architectures will be combined with a deep trench micromachining technology developed at BSAC. The extremely thick structures will dramatically increase sensitivity and hence improve performance. Integrating circuits with these sensors will allow temperature compensation, filtering, exceptional miniaturization, and digital output. The goal of Phase I is to prove that micromachining can produce sensors and sensor systems with the performance required for seismic and infrastructure monitoring. Complete mechanical sensor and electrical circuit design will verify feasibility and allow rapid fabrication of functional devices in Phase II. Market research firms forecast inexpensive, micromachined inertial sensors to command a market of over one billion dollars with unit sales in the tens of millions by the year 2000. High volume commercial applications such as automotive safety, virtual reality, 3-D computer mice, and machine monitoring already incorporate miniature sensors which can be vastly improved using this technology. The high performance micro-sensors envisioned open new frontiers such as augmented GPS navigation, general aviation, robotics, and platform leveling. Integrated Micro Instruments has be en approached by venture capitalists and a military contractor continuing the very high level of commercial interest. ***