SBIR Phase I: Real-Time Sensing and Control for Physical Vapor Deposition (PVD) Processes in IC Manufacture

Sensys仪器公司将开发创新的声学传感器和基于模型的多变量控制技术，以测量和控制物理气相沉积（PVD）工艺中的晶圆温度和薄膜厚度，这是半导体器件晶圆制造中的关键技术。目前市面上还没有能够实时测量PVD工艺中晶圆温度和厚度的传感器。该项目将创建一个集成的传感器硬件、信号处理软件和控制软件，适用于PVD设备。

Sensys Instruments Corp. will develop innovative acoustic sensor and model-based multivariable control technology to measure and control wafer temperature and film thickness in Physical Vapor Deposition (PVD) processes, a key technology used in semiconductor device wafer fabrication. There are currently no commercially available sensors that can provide real-time measurements of wafer temperature and thickness in PVD processes. This project will create an integrated package of sensor hardware, signal processing software and control software, adapted for PVD equipment.