SBIR Phase I: Photodefinable, Integrated, High Capacitance Composites for MCM-L Type Substrates

SBIR 第一阶段：用于 MCM-L 型基板的可光定义、集成、高电容复合材料

• 批准号: 9761618
• 负责人: Kristen Law
• 金额: $ 10万
• 依托单位: TPL, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1998
• 资助国家: 美国
• 起止时间: 1998-01-01 至 1998-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9761618&HistoricalAwards=false
• 关键词: SBIR; Phase; Photodefinable; Integrated; Capacitance

*** 9761618 Law This Small Business Innovation Research Phase I project aims to synthesize a new, high capacitance polyimide-barium titanate polyamic acid which will be patterned by contact photolithography to produce a polyimide composite network having an order of magnitude higher capacitance than current polyimide composite materials. The next generation of electronic packaging requires the replacement of discrete passive devices with embedded material to achieve the necessary gains in component density, performance, and cost reductions. Of the three passive components, resistors, inductors, and capacitors, it is capacitors that are used in the highest quantities, and have received the smallest amount of integration research. Current capacitive materials for MCM-L substrates lack the dielectric properties which will be required for future performance improvements. A composite dielectric material composed of a newly synthesized photo-active and high polarity polyimide with nanometer scale ceramic powder will be able to meet the performance, thermal, and processing requirements required for developing embedded capacitance devices. The total North American printed circuit board market is currently at $6 billion, with no integrated passive components. By the year 2007, total PC board estimates are at $13 billion, with approximately one quarter of that expected to be generated by boards employing integrated passive devices. Current discrete passive component costs are $0.10 per component, plus an additional $0.03 for insertion. Even with a slight premium for developing new embedded materials, the savings involved in eliminating insertion costs are substantial. ***

*** 9761618 Law 该小企业创新研究第一阶段项目旨在合成一种新型高电容聚酰亚胺钛酸钡聚酰胺酸，该聚酰亚胺钛酸钡聚酰胺酸将通过接触光刻法进行图案化，以产生比现有聚酰亚胺复合材料电容高一个数量级的聚酰亚胺复合网络。下一代电子封装需要用嵌入式材料取代分立无源器件，以实现元件密度、性能和成本降低方面的必要提升。 在电阻、电感、电容这三种无源元件中，电容的用量最多，且集成度研究量最少。 目前用于 MCM-L 基板的电容材料缺乏未来性能改进所需的介电特性。 由新合成的光活性和高极性聚酰亚胺与纳米级陶瓷粉末组成的复合介电材料将能够满足开发嵌入式电容器件所需的性能、热和加工要求。 目前北美印刷电路板市场总额为 60 亿美元，其中没有集成无源元件。 到 2007 年，PC 板总价值预计将达到 130 亿美元，其中大约四分之一预计将由采用集成无源器件的板产生。 当前分立无源元件的成本为每个元件 0.10 美元，另加 0.03 美元的插入费用。 即使开发新嵌入材料的费用稍高，消除嵌入成本所节省的成本也是巨大的。 ***