SBIR Phase I: Photodefinable, Integrated, High Capacitance Composites for MCM-L Type Substrates

*9761618法则这个小型企业创新研究第一阶段项目旨在合成一种新型的高容量聚酰亚胺-钛酸钡聚酰胺酸，这种聚酰亚胺将通过接触光刻进行图案化，以产生比目前的聚酰亚胺复合材料高一个数量级的聚酰亚胺复合网络。下一代电子封装需要用嵌入材料取代分立的无源器件，以在元件密度、性能和成本降低方面实现必要的收益。在电阻、电感和电容器这三种无源元件中，电容器的使用量最大，得到的集成研究最少。目前用于多芯片组件-L基板的电容材料缺乏未来性能改进所需的介电性能。由新合成的光活性高极性聚酰亚胺和纳米陶瓷粉末组成的复合介质材料将能够满足开发嵌入式电容器件所需的性能、热和工艺要求。北美印刷电路板市场总额目前为60亿美元，没有集成无源元件。到2007年，PC电路板的总估计价值为130亿美元，其中约四分之一预计将来自采用集成无源器件的电路板。目前分立的无源组件成本为每个组件0.10美元，外加0.03美元的插入费。即使开发新的嵌入材料有轻微的溢价，消除插入成本所涉及的节省也是相当可观的。***

*** 9761618 Law This Small Business Innovation Research Phase I project aims to synthesize a new, high capacitance polyimide-barium titanate polyamic acid which will be patterned by contact photolithography to produce a polyimide composite network having an order of magnitude higher capacitance than current polyimide composite materials. The next generation of electronic packaging requires the replacement of discrete passive devices with embedded material to achieve the necessary gains in component density, performance, and cost reductions. Of the three passive components, resistors, inductors, and capacitors, it is capacitors that are used in the highest quantities, and have received the smallest amount of integration research. Current capacitive materials for MCM-L substrates lack the dielectric properties which will be required for future performance improvements. A composite dielectric material composed of a newly synthesized photo-active and high polarity polyimide with nanometer scale ceramic powder will be able to meet the performance, thermal, and processing requirements required for developing embedded capacitance devices. The total North American printed circuit board market is currently at $6 billion, with no integrated passive components. By the year 2007, total PC board estimates are at $13 billion, with approximately one quarter of that expected to be generated by boards employing integrated passive devices. Current discrete passive component costs are $0.10 per component, plus an additional $0.03 for insertion. Even with a slight premium for developing new embedded materials, the savings involved in eliminating insertion costs are substantial. ***