Dynamic Probes of Tribological Processes

两个主要的研究领域处理的基本问题，在摩擦和磨损将并行进行：1）应力包括材料去除沿着原子和分子的步骤将使用扫描探针显微镜的腐蚀性流体中的陶瓷材料的特点。基本溶解过程的活化体积和热活化能将被确定并用于系统的建模工作。研究结果将应用于硅和二氧化硅材料的化学机械抛光。2)将进行摩擦学探针的瞬态电流实验。它们将被设计为提供关于电荷分离、摩擦发射和电偶电流的物理和化学的信息，以及它们与粘附力和摩擦、磨损和润滑剂降解过程的关系。*

Two major areas of study dealing with fundamental issues in friction and wear will be pursued in parallel: 1) stress-included material removal along atomic and molecular steps will be characterized using scanning probe microscopy for ceramic materials in corrosive flluids. Activation volumes and thermal activation energies for the fundamental dissolution processes will be determined and used in a systematic modeling effort. The results will be applied to chemo-mechanical polishing of silicon and silicon dioxide materials. 2) transient electrical current ecxperiments for tribological probes will be carried out. They will be designed to provided information about the physics and chemistry of charge separartion, tribo-emission, and galvanic currents and their relation to adhesion forces and to fructioon, wear and lubricant degradation processes.***