Dynamic Probes of Tribological Processes

两个主要的研究领域涉及摩擦和磨损的基本问题，将并行进行：1)将使用扫描探针显微镜对腐蚀流体中的陶瓷材料进行表征，沿原子和分子步骤去除应力。基本溶解过程的激活体积和热活化能将被确定并用于系统的建模工作。研究结果将应用于硅和二氧化硅材料的化学机械抛光。2)对摩擦探头进行瞬态电流实验。它们将提供有关电荷分离、摩擦发射和电流的物理和化学信息，以及它们与附着力、结构、磨损和润滑剂降解过程的关系

Two major areas of study dealing with fundamental issues in friction and wear will be pursued in parallel: 1) stress-included material removal along atomic and molecular steps will be characterized using scanning probe microscopy for ceramic materials in corrosive flluids. Activation volumes and thermal activation energies for the fundamental dissolution processes will be determined and used in a systematic modeling effort. The results will be applied to chemo-mechanical polishing of silicon and silicon dioxide materials. 2) transient electrical current ecxperiments for tribological probes will be carried out. They will be designed to provided information about the physics and chemistry of charge separartion, tribo-emission, and galvanic currents and their relation to adhesion forces and to fructioon, wear and lubricant degradation processes.***