SBIR Phase I: Low Thermal Expansion Substrate Containing Multiple Micro-Heat Pipes

SBIR第一期：包含多个微热管的低热膨胀基板

• 批准号: 9861183
• 负责人: Jared Sommer
• 金额: $ 10万
• 依托单位: Materials and Electrochemical Research Corporation (MER)
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1999
• 资助国家: 美国
• 起止时间: 1999-01-01 至 1999-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9861183&HistoricalAwards=false
• 关键词: SBIR; Phase; Low; Thermal; Expansion

9861183 This Small Business Innovation Research Phase I project will investigate a novel process to produce low-cost heat sink plates containing arrays of wickless micro-heat pipes with effective capillary diameters on the order of 50-200 microns. As the speed of advanced electronic systems has increased dramatically in recent years, there has been growing interest in substrates containing arrays of micro-heat pipes for use in the thermal control of high power transistors and electronic circuits. The effective thermal conductivity of an individual micro-heat pipe can be orders of magnitude higher than the thermal conductivity of pure copper metal. No fabrication method currently exists to economically produce low-cost substrates containing arrays of micro-heat pipes. In Phase I, micro-heat pipes will be fabricated on a metallic substrate that exhibit a thermal expansion similar to silicon-based electronic components. The proposed micro-heat pipe plates will exhibit effective thermal conductivities significantly higher than pure copper metal and will be used commercially as heat sinks, heat spreaders, and thermal core materials. Micro-heat pipe substrates may be applied directly to the thermal management of commercial electronic systems such as heat sinks, thermal cores or heat spreading devices.

9861183 这个小型企业创新研究第一阶段项目将研究一种新的工艺，以生产低成本的散热板，其中包含有效毛细管直径为50-200微米的无芯微热管阵列。近年来，随着先进电子系统的速度急剧增加，对包含用于高功率晶体管和电子电路的热控制的微热管阵列的衬底的兴趣日益增加。单个微热管的有效导热率可以比纯铜金属的导热率高几个数量级。目前不存在经济地生产包含微热管阵列的低成本基板的制造方法。在第一阶段，微热管将在金属基板上制造，其热膨胀类似于硅基电子元件。所提出的微热管板将表现出显著高于纯铜金属的有效导热率，并将在商业上用作散热器、散热器和热芯材料。 微热管基板可直接应用于商业电子系统的热管理，例如散热器、热芯或散热装置。