SBIR Phase I:Multimodal High-Conductivity Filler for Epoxy Molding Compounds

这个小企业创新研究（SBIR）第一阶段项目将通过优化金刚石粉的多模态分布，研究在高包装密度的环氧成型化合物中加入金刚石粉的可行性。这些复合封装剂的导热系数预计将高于100 W/mK。选择具有高导热性的半导体成型化合物对于消散高功率电子元件产生的热量至关重要，特别是当未来芯片的特征尺寸减小时。大多数用于封装半导体的环氧树脂成型化合物都含有熔融二氧化硅（体积为55-70%），以保持相容的热膨胀系数并具有防潮性。然而，复合材料的导热系数非常低（3 W/mK）。通过加载具有优化金刚石粉末分布的商业成型环氧树脂，可以在粘度与商业成型工艺相容的环氧成型液中获得65%以上的金刚石体积分数。金刚石/环氧树脂成型化合物将作为导热性的上限基准材料，并将用于散热至关重要的高性能微电子封装应用。

This Small Business Innovation Research (SBIR) Phase I Project will investigate the feasibilityof incorporating diamond powder in epoxy molding compounds at high packing densities using optimized multi-modal distributions of diamond powder. The resulting thermalconductivities of these composite encapsulants are expected to be higher than 100 W/mK. Selection of semiconductor molding compounds that exhibit high thermal conductivity are crucial in dissipating heat generated by high-power electronic components, particularly as feature sizes of future chips decrease in size. Most epoxy molding compounds used to encapsulate semiconductors contain fused silica (55-70% by volume) to maintain acompatible thermal expansion coefficient and impart moisture resistance. However, theresulting thermal conductivities of the composite compounds are very low (3 W/mK). Byloading commercial molding epoxies with optimized diamond powder distributions, diamond volume fractions above 65% may be obtained in the epoxy molding liquid with a viscosity compatible with commercial molding processes. The diamond/epoxy molding compound will serve as a upper-limit benchmark material for thermal conductivity and will be used in high-performance microelectronic packaging applications where heat dissipation is critical.