SBIR Phase II: Multimodal High-Conductivity Filler for Epoxy Molding Compounds

SBIR 第二阶段：用于环氧模塑料的多峰高导填料

• 批准号: 0349517
• 负责人: Jared Sommer
• 金额: $ 49.94万
• 依托单位: Sommer Materials Research, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2004
• 资助国家: 美国
• 起止时间: 2004-02-15 至 2006-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0349517&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Multimodal; Conductivity

This Small Business Innovation Research Phase II project will focus on developing more efficient semiconductor packaging materials, which is one of the key challenges of the electronics industry where increasing power and reduced size of integrated circuits is creating heat dissipation challenges. Most epoxy molding compounds used toencapsulate semiconductors contain fused silica (55-70% by volume) to maintain acompatible thermal expansion coefficient and impart moisture resistance. However, theresulting thermal conductivities of the composite compounds are very low (1 W/mK). Thelow thermal conductivity of the epoxy molding compound increases the operating temperatures, which in turn decreases the reliability and processing speed of microprocessors. As semiconductor clock speeds continue to increase and chip sizes decrease, the need for higher thermally conductive molding materials has become a stark necessity. In Phase I of this project multi-modal distributions of high-conductivity diamond powder where optimized to obtain high packing densities (over 72% by volume) in epoxy molding compounds. The resulting thermal conductivities of diamond/epoxy composites were almost 8 times higher than conventional silica-filled epoxies and almost 30 times higher than the epoxy matrix. The thermal expansions of silica and diamond filler are similarly low, thus allowing better matching to silicon. In this Phase II project significantly higher thermal conductivities are to be achieved by optimizing the epoxy/hardener system with the diamond filler to improve bonding and thereby improving the heat transfer mechanism. The diamond filler will be used as a direct substitute for commercially available silica filler, requiring little or no modification of existing equipment or processing. The diamond/epoxy molding compound will effectively act as a heat-spreader. The diamond filler will allow higher switching speeds, thinner oxide gates and increased reliability ofelectronics. The project team will work with an epoxy molding compound (EMC) manufacturer to introduce the diamond filler into the commercial market towards the end of Phase II.Commercial markets for this EMC technology include high-performance aerospace, automobile and microelectronic packaging applications, where heat dissipation from the packaging material outweighs the increased material cost. The increased thermal conductivity offered by the diamond filler will benefit the business and scientific community by increasing computing speed and hardware reliability. Studies indicate that heat dissipation and associated thermal problems are the most critical factors in determining the efficiency and reliability of electronic devices. In terms of scientific and educational value, EMC's incorporating the optimized diamond filler will exhibit the maximum thermal conductivity obtainable and serve as the upper-limit benchmark in thermal conductivity for the composite material.

这个小型企业创新研究第二阶段项目将专注于开发更高效的半导体封装材料，这是电子行业的关键挑战之一，因为集成电路的功率增加和尺寸缩小带来了散热挑战。大多数用于封装半导体的环氧模塑料含有熔融二氧化硅(体积分数为55-70%)，以保持兼容的热膨胀系数并提供防潮性能。然而，复合材料的导热系数很低(1W/mK)。环氧模塑料的低导热系数增加了工作温度，这反过来又降低了微处理器的可靠性和处理速度。随着半导体时钟速度的不断提高和芯片尺寸的减小，对导热系数更高的成型材料的需求已成为一种赤裸裸的需求。在该项目的第一阶段，对高导电性钻石粉末的多模式分布进行了优化，以获得高填充密度(以体积计超过72%)的环氧模塑化合物。结果表明，金刚石/环氧复合材料的导热系数比传统的二氧化硅填充环氧树脂高近8倍，比环氧基树脂高近30倍。二氧化硅和钻石填料的热膨胀同样很低，因此可以更好地与硅匹配。在该二期工程中，通过使用金刚石填料优化环氧树脂/固化剂体系，以改善粘结，从而改善传热机理，从而实现显着更高的导热系数。这种金刚石填料将被用作商业上可获得的二氧化硅填料的直接替代品，只需对现有设备或工艺进行很少或根本不需要修改。钻石/环氧模塑化合物将有效地起到散热的作用。钻石填充物将允许更高的开关速度、更薄的氧化物栅极和更高的电子可靠性。项目团队将与一家环氧模塑化合物(EMC)制造商合作，在第二阶段结束时将钻石填充物引入商业市场。这种EMC技术的商业市场包括高性能航空航天、汽车和微电子封装应用，在这些应用中，包装材料的散热超过了增加的材料成本。钻石填充物提供的更高的导热系数将通过提高计算速度和硬件可靠性而使商业和科学界受益。研究表明，散热和与之相关的热问题是决定电子器件效率和可靠性的最关键因素。在科学和教育价值方面，EMC加入优化的金刚石填料将显示出可获得的最大导热系数，并作为复合材料导热系数的上限基准。