CAREER: A Wireless Sensor Instrumentation System for Harsh Environments

9875206 kornegay航空航天和国防系统应用，无论是在军事领域还是民用领域，都对能够在恶劣环境中生存的电子系统的传感器技术的发展提出了很高的要求。这些需求将通过宽禁带材料来满足，但更重要的是，如何利用这些材料的好处。该提案涵盖了为恶劣环境应用（例如，高温，腐蚀性，侵蚀等）开发无线微机电系统（MEMS）技术的努力。该研究计划通过在碳化硅（SiC）制造、电路集成和电子封装方面的创新研究，为实现无线传感器仪器系统提供了直接途径。无线传感器的支持电子器件将提供信号转换、通信和自校准功能。所有的制造都将在康奈尔纳米制造设施（CNF）完成，所有的封装工作，包括高温贴片材料、电线和线键的开发，都将在康奈尔先进电子封装设施完成。该研究计划将通过创新的教育活动得到加强，这些活动将研究和教学与实际的实践经验结合起来。他将开设一门多学科课程，名为“恶劣环境下的集成电子学”。本课程将教授微电子集成原理，并将其应用于恶劣环境下MEMS的设计和分析。它将涵盖宽带隙材料、制造技术、器件、电路、封装、系统集成、团队工作以及通过万维网促进的计算原型CAD工具的有效使用等主题。研究生导师还将被介绍到政府和工业实验室的问题，这将帮助他们获得宝贵的实践经验，并了解与政府和工业需求相关的研究

9875206KornegayAerospace and defense system applications, both in the military and civilian arenas, place heavy demands on the development of sensor technology for electronic systems that can survive in harsh environments. These demands will be met by wide bandgap materials, but more importantly, how the benefits of using these materials can be exploited. This proposal covers an effort to develop wireless microelectromechanical systems (MEMS) technology for harsh environment applications (e.g., high temperature, corrosive, erosive, etc.). The research plan offers a direct path to the realization of a wireless sensor instrumentation system through innovative research in silicon carbide (SiC) fabrication, circuit integration, and electronic packaging. The support electronics for the wireless sensor will provide signal conversion, communication, and self-calibration functions. All fabrication will be done in the Cornell Nanofabrication Facility (CNF) and all packaging work, including development of high temperature die attach materials, wires and wire bonds, will be done in the Cornell Advanced Electronic Packaging Facility.The research plan will be augmented with innovative educational activities that integrate research and teaching with practical hands-on experiences. A multidisciplinary course titled "Integrated Electronics for Harsh Environments," will he developed. The course will teach microelectronic integration principles, and apply them to the design and analysis of MEMS for harsh environments. It will cover topics in wide bandgap materials, fabrication technology, devices, circuits, packaging, system integration, working in teams, and the effective use of computational prototyping CAD tools facilitated by the World Wide Web. Graduate student advisees will also be introduced to problems at government and industrial laboratories that will help them acquire valuable hands-on experience as welt as learn about research that is relevant to the needs of government and industry.***