CAREER: A Wireless Sensor Instrumentation System for Harsh Environments
职业:适用于恶劣环境的无线传感器仪表系统
基本信息
- 批准号:9875206
- 负责人:
- 金额:$ 23.5万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:1999
- 资助国家:美国
- 起止时间:1999-07-01 至 2003-06-30
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
9875206KornegayAerospace and defense system applications, both in the military and civilian arenas, place heavy demands on the development of sensor technology for electronic systems that can survive in harsh environments. These demands will be met by wide bandgap materials, but more importantly, how the benefits of using these materials can be exploited. This proposal covers an effort to develop wireless microelectromechanical systems (MEMS) technology for harsh environment applications (e.g., high temperature, corrosive, erosive, etc.). The research plan offers a direct path to the realization of a wireless sensor instrumentation system through innovative research in silicon carbide (SiC) fabrication, circuit integration, and electronic packaging. The support electronics for the wireless sensor will provide signal conversion, communication, and self-calibration functions. All fabrication will be done in the Cornell Nanofabrication Facility (CNF) and all packaging work, including development of high temperature die attach materials, wires and wire bonds, will be done in the Cornell Advanced Electronic Packaging Facility.The research plan will be augmented with innovative educational activities that integrate research and teaching with practical hands-on experiences. A multidisciplinary course titled "Integrated Electronics for Harsh Environments," will he developed. The course will teach microelectronic integration principles, and apply them to the design and analysis of MEMS for harsh environments. It will cover topics in wide bandgap materials, fabrication technology, devices, circuits, packaging, system integration, working in teams, and the effective use of computational prototyping CAD tools facilitated by the World Wide Web. Graduate student advisees will also be introduced to problems at government and industrial laboratories that will help them acquire valuable hands-on experience as welt as learn about research that is relevant to the needs of government and industry.***
9875206KornegyAerospace和国防系统的应用,无论是在军事和民用领域,放置在传感器技术的发展,可以在恶劣的环境中生存的电子系统的沉重的要求。这些需求将通过宽带隙材料来满足,但更重要的是,如何利用这些材料的好处。该提案涵盖了开发用于恶劣环境应用的无线微机电系统(MEMS)技术的努力(例如,高温、腐蚀性、侵蚀性等)。该研究计划通过碳化硅(SiC)制造、电路集成和电子封装方面的创新研究,为实现无线传感器仪器系统提供了直接途径。无线传感器的支持电子设备将提供信号转换、通信和自校准功能。所有的制造工作将在康奈尔纳米纤维工厂(CNF)完成,所有的封装工作,包括高温芯片粘接材料,导线和引线键合的开发,将在康奈尔先进电子封装工厂完成。研究计划将通过创新的教育活动,将研究和教学与实际动手经验相结合来加强。他将开发一门名为“恶劣环境下的集成电子学”的多学科课程。本课程将教授微电子集成原理,并将其应用于恶劣环境下的MEMS设计和分析。它将涵盖宽带隙材料,制造技术,器件,电路,封装,系统集成,团队工作,以及有效使用万维网促进的计算原型CAD工具等主题。研究生实习生也将被介绍给政府和工业实验室的问题,这将帮助他们获得宝贵的实践经验,以及了解与政府和工业需求相关的研究。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Kevin Kornegay其他文献
Systematic design of wideband ΔΣ modulators for WiFi/WiMAX receivers
- DOI:
10.1007/s10470-010-9471-y - 发表时间:
2010-04-30 - 期刊:
- 影响因子:1.400
- 作者:
Pukar Malla;Hasnain Lakdawala;Ravi Naiknaware;Krishnamurthy Soumyanath;Kevin Kornegay - 通讯作者:
Kevin Kornegay
Kevin Kornegay的其他文献
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{{ truncateString('Kevin Kornegay', 18)}}的其他基金
CyberCorps Scholarship for Service: Secure Embedded Systems
CyberCorps 服务奖学金:安全嵌入式系统
- 批准号:
2042700 - 财政年份:2021
- 资助金额:
$ 23.5万 - 项目类别:
Continuing Grant
SaTC: Frontiers: Collaborative: Security and Privacy in the Lifecycle of IoT for Consumer Environments (SPLICE)
SaTC:前沿:协作:消费者环境物联网生命周期中的安全和隐私 (SPLICE)
- 批准号:
1955231 - 财政年份:2020
- 资助金额:
$ 23.5万 - 项目类别:
Continuing Grant
RISE: Embedded Systems Security via Reverse Engineering and Countermeasures
RISE:通过逆向工程和对策实现嵌入式系统安全
- 批准号:
1458930 - 财政年份:2015
- 资助金额:
$ 23.5万 - 项目类别:
Standard Grant
A Look at Temperature Dependent Parameters for Digital Circuit Design Considerations using SiC Mosfet Technology
使用 SiC Mosfet 技术研究数字电路设计考虑因素的温度相关参数
- 批准号:
9521901 - 财政年份:1995
- 资助金额:
$ 23.5万 - 项目类别:
Standard Grant
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