An Experimental and Theoretical Study of Reactive Wetting in Low Melting Point Alloy/Metal Systems

低熔点合金/金属体系中反应润湿的实验和理论研究

• 批准号: 9902783
• 负责人: Bruce Murray
• 金额: $ 33.32万
• 依托单位: SUNY at Binghamton
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1999
• 资助国家: 美国
• 起止时间: 1999-09-01 至 2002-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9902783&HistoricalAwards=false
• 关键词: Experimental; Theoretical; Study; Reactive; Wetting

9902783MurrayTo enhance fundamental understanding of soldering, this research examines the wetting, spreading and dissolution of low melting point solders on metals. A comprehensive set of experiments is planned in which the chronological sequence of drop spreading is synchronized with output from a sensitive calorimeter. Visual data are used to establish the mobility relationship, a relationship between contact angle and triple line speed, for a particular material system. Calorimetry data provide information on the types of phase changes and reaction phenomena (such as dissolution) that occur as the spreading progresses. This approach should permit the first correlations between visual wetting data, phase changes and reactions for metal/metal systems. Direct observations of solder spreading, wetting and reactions with metals are correlated with structural characterizations of the samples cooled to room temperature, or of similar samples quenched to room temperature at various times during the run. These data provide powerful tests of models for reactive spreading. Using these tests, quantitative mathematical models of solder wetting of metallic substrates with and without reaction between the substrate and solder are developed. These computational models, ranging from one-dimensional diffusion to a two-dimensional flow model with capillary effects and multi-component transport, provide better fundamental understanding and the ability to treat different material systems whose requisite physicochemical properties are known. Ultimately, the computational model will permit creation of a design tool that can be used to analyze new solder systems.%%%Although soldering has become a critical, widespread process in electronics manufacturing, solder wetting and soldering reactions are poorly understood. Improved understanding is needed to develop new soldering procedures particularly at smaller length scales. This will allow the industry to meet new challenges, including stricter environmental regulations on the material constituents of solder alloys and the demand for the use of microelectronic devices in harsh surroundings.***

9902783 Murray为了加强对焊接的基本理解，本研究考察了低熔点焊料在金属上的润湿、铺展和溶解。 一套全面的实验计划，其中液滴扩散的时间顺序是同步的输出从一个敏感的热量计。 视觉数据用于建立特定材料系统的迁移率关系，即接触角和三线速度之间的关系。 量热法数据提供了关于在铺展过程中发生的相变类型和反应现象（如溶解）的信息。 这种方法应该允许第一个视觉润湿数据，相变和金属/金属系统的反应之间的相关性。 焊料的扩散，润湿和与金属的反应的直接观察与冷却到室温的样品的结构表征，或类似的样品淬火到室温在不同的时间在运行过程中。 这些数据为反应扩散模型提供了强有力的测试。 使用这些测试，定量的数学模型的焊料润湿的金属基板与基板和焊料之间的反应和没有开发。 这些计算模型，从一维扩散到具有毛细管效应和多组分运输的二维流动模型，提供了更好的基本理解和处理不同材料系统的能力，这些材料系统的必要物理化学性质是已知的。 最终，计算模型将允许创建可用于分析新焊料系统的设计工具。%%%虽然焊接已经成为电子制造中一个重要的、广泛的工艺，但对焊料润湿和焊接反应的了解很少。 需要更好的理解来开发新的焊接工艺，特别是在较小的长度尺度上。这将使该行业能够应对新的挑战，包括对焊料合金材料成分的更严格的环境法规以及在恶劣环境中使用微电子器件的需求。