权益分类	功能权益	普通用户	{{item.name}}会员
{{category.name}}	{{benefitItem.name}}

SBIR Phase I: A 2GHz Bandwidth Cross-Correlator Chip for Interferometry

SBIR 第一阶段：用于干涉测量的 2GHz 带宽互相关器芯片

基本信息

批准号：
9960496
负责人：
Constantin Timoc
金额：
$ 10万
依托单位：
Spaceborne Inc
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
2000
资助国家：
美国
起止时间：
2000-01-01 至 2000-06-30
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=9960496&HistoricalAwards=false
关键词：
SBIR Phase 2GHz Bandwidth Cross

项目摘要

This Phase I Small Business Innovation Research project aims to research, develop, and demonstrate experimentally a novel cross-correlator chip and a high-speed multi-chip module package, the basic building blocks of an expandable cross-correlator system, with a frequency bandwidths of 2 GHz and priced at one tenth of the cost of existing cross-correlator systems with the same bandwidth. To achieve the stated goal, no single conventional technical approach could provide a cross-correlator chip operating at such high frequency bandwidth and at such a low cost -- only by synergistically combining innovative parallel architecture, bit-systolic arrays, novel digital circuit techniques, and deep sub-micron CMOS fabrication technologies can this unprecedented level of performance-to-cost ratio be obtained. The correlator chip and the high-speed multi-chip module to be developed in this project, if successfully realized, will have the advantage of enabling the implementation of expandable cross-correlator systems that cost 10 to 20 times less than comparable systems envisioned for large interferometer arrays operating at millimeter andsub-millimeter wavelengths.The family of state of the art cross-correlator chips and multi-chip modules produced in this project will have applications in radio astronomy, earth science, geodesy and surveillance.

第一阶段小型企业创新研究项目旨在研究、开发和实验演示一种新型互相关器芯片和一种高速多芯片模块封装，这是可扩展互相关器系统的基本组成部分，其频率带宽为2 GHz，价格为相同带宽的现有互相关器系统的十分之一。为了实现所述目标，没有一种传统的技术方法可以提供在如此高的频率带宽和如此低的成本下工作的互相关器芯片--只有通过协同地结合创新的并行架构、位脉动阵列、新颖的数字电路技术和深亚微米CMOS制造技术，才能获得这种前所未有的性能成本比水平。本项目所要开发的相关器芯片和高速多芯片模块，如果成功实现，将具有能够实现可扩展互相关器系统的优点，该互相关器系统的成本比为在毫米和亚毫米波长下操作的大型干涉仪阵列设想的可比系统低10至20倍。该项目生产的芯片模块将应用于射电天文学，地球科学，大地测量学和监测。