Measurement of Microscopic Residual Stress Based on the Evolution of Surface Roughness During Shallow Chemical Etching

基于浅层化学蚀刻过程中表面粗糙度演变的微观残余应力测量

• 批准号: 0070057
• 负责人: Kyung-Suk Kim
• 金额: $ 25.06万
• 依托单位: Brown University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-04-01 至 2004-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0070057&HistoricalAwards=false
• 关键词: Measurement; Microscopic; Residual; Stress; Based

A study will be made of stress-induced surface roughening caused by shallow chemical surface etching. The results will be adapted to residual-stress measurement. Previous work has shown that a simple spectrum analysis of nanometer-scale height changes in surface roughness caused by chemical etching permits determination of residual-stress components in solids. The principle of the analysis is that etching triggers stress-induced surface instability, resulting in a roughening of the surface controlled by the magnitude of the residual stresses and their direction. The experimental method is called "surface roughness-evolution spectroscopy (SRES)," and it measures residual stress components in solids with high spatial resolution. The study will include modeling and experimental studies of surface roughening caused by various etchants in shallow chemical etching; this research is expected to provide fundamental understanding of the roughening process of stressed solid surfaces, while etched chemically. In addition, the understanding will be applied to measuring microscopic residual stresses in technologically important solid structures, e.g. manufacturing-induced residual stresses in optical fibers and intra-granular residual stresses in polycrystalline solids. The resulting experimental method of skin test for residual-stress measurement is expected to make a significant impact in assessing manufacturability, reliability and residual life of solid components, which is essential in developing and maintaining proper infrastructures of civil and mechanical systems.

对浅层化学腐蚀引起的应力诱导表面粗化进行了研究。结果将适用于残余应力的测量。以前的工作表明，通过对化学腐蚀引起的表面粗糙度纳米级高度变化的简单频谱分析，可以确定固体中的残余应力成分。分析的原理是，刻蚀触发了应力引起的表面不稳定性，导致了由残余应力的大小和方向控制的表面粗糙。这种实验方法被称为“表面粗糙度演化光谱(SRES)”，它以高空间分辨率测量固体中的残余应力分量。这项研究将包括各种腐蚀剂在浅层化学腐蚀中引起表面粗糙的建模和实验研究；这项研究有望提供对化学腐蚀时应力固体表面粗糙过程的基本理解。此外，这一理解将用于测量具有重要技术意义的固体结构中的微观残余应力，例如光纤中的制造引起的残余应力和多晶固体中的晶内残余应力。由此产生的用于测量残余应力的皮肤试验方法预计将对评估固体部件的可制造性、可靠性和剩余寿命产生重大影响，这对于开发和维护适当的土木工程和机械系统基础设施是必不可少的。