Gordon Research Conference on Electrodeposition, New London, NH, August 13-18, 2000

风暴电沉积是世纪以来重要的材料制备技术。Read会议的历史，现在是电沉积GRC，涉及金属的形成：Cu，Ag，Au，Cr和Ni，用于汽车保险杠，触点，电铸等。也就是说，组织者认为，如果我们能够开辟电沉积并研究新的前沿领域，而不是讨论更好的方法来做已经做的事情，那么会议将产生更大的影响。 近年来，随着扫描隧道显微镜（STM）等新的分析方法的发展，对原子尺度电沉积的理解急剧增加。这导致了对工艺的改进控制，以及在需要对纳米尺度进行控制的领域中使用电沉积的能力。会议目前的主题领域包括超大规模集成电路中的铜电沉积、磁性材料、微机电系统（MEMS）、半导体、表面表征和纳米结构。在这些标题下，电结晶的基本方面，添加剂对电沉积膜的形态演变的影响，自催化过程，和功能涂层，显示有前途的磨损和/或腐蚀行为将被讨论。从第一届到第二届，会议规模不断扩大，我们希望将其发展成为一流的材料会议。国家科学基金会的资金用于补贴学生和年轻教师的旅行和固定费用，他们如果没有经济支持就无法参加。%电沉积戈登研究会议（GRC）是相对较新的，在1996年开始。它起源于阅读会议，这是自50年代初以来电沉积社区的主要科学论坛之一。电沉积法作为一种标准的薄膜合成方法在新的领域正逐渐被人们所接受。一个明显的例子是电子工业采用电沉积来形成VLSI中的Cu互连。此外，它在磁性材料、合金的形成和微机械加工部件的形成中也越来越重要。它可能发挥作用的新领域包括纳米纤维和化合物半导体薄膜的形成。

0070426StormElectrodeposition has been an important materials preparation technique since the turn of the century. The history of the Read Conference, and now the Electrodeposition GRC, has involved the formation of metals: Cu, Ag, Au, Cr and Ni, for car bumpers, contacts, electroforming, etc. The present organizers seek to change the focus of the conference from what is, to what could be. That is, the organizers feel the conference will have more impact if we can open up electrodeposition and investigate new, frontier, areas instead of discussing better ways to do what is already being done. Understanding of electrodeposition at the atomic scale has increased dramatically in recent years, as new analytical methods like scanning tunneling microscopy (STM) have been developed. This has resulted in improved control over processes, and the ability to use electrodeposition in areas where control over the nanometer scale is required. The present topic areas for the conference include copper electrodeposition in VLSI, magnetic materials, micro electromechanical systems (MEMS), semiconductors, surface characterization, and nanostructures. Under these headings, fundamental aspects of electrocrystallization, the effects of additives on morphological evolution of electrodeposited films, autocatalytic processes, and functional coatings which show promising wear and/or corrosion behavior will be discussed. The conference has seen dramatic growth from the first to the second, and we would like to develop it into a premier materials conference. The NSF funds are used to subsidize the travel and fixed fees of students and young faculty who would not be able to participate without financial support. %%%The Electrodeposition Gordon Research Conference (GRC) is relatively new, having started in 1996. It grew out of the Read Conference, one of the primary scientific forums for the electrodeposition community since the early 50's. Electrodeposition is becoming accepted as a standard thin film synthesis methodology in new areas. A clear example is the adoption of electrodeposition by the electronics industries to form Cu interconnects in VLSI. In addition, it is gaining importance in the formation of magnetic materials, alloys, and the formation of micromachined parts. New areas where it may play a roll include nanofabrication and the formation of compound semiconductor thin films.***