Gordon Research Conference on Electrodeposition, New London, NH, August 13-18, 2000

自世纪之交以来，电沉积已成为一种重要的材料制备技术。从Read会议的历史，到现在的电沉积GRC，已经涉及到金属的形成：Cu， Ag, Au， Cr和Ni，用于汽车保险杠，触头，电铸等。目前的组织者试图将会议的焦点从“是什么”转变为“可能是什么”。也就是说，组织者认为，如果我们能够开辟电沉积和研究新的前沿领域，而不是讨论更好的方法来做已经做过的事情，会议将产生更大的影响。近年来，随着扫描隧道显微镜（STM）等新的分析方法的发展，对原子尺度电沉积的认识急剧增加。这导致了对工艺的改进控制，以及在需要控制纳米尺度的区域使用电沉积的能力。会议目前的主题领域包括VLSI中的铜电沉积，磁性材料，微机电系统（MEMS），半导体，表面表征和纳米结构。在这些标题下，将讨论电结晶的基本方面，添加剂对电沉积膜形态演变的影响，自催化过程和显示有希望的磨损和/或腐蚀行为的功能涂层。从第一届到第二届，会议经历了巨大的发展，我们希望把它发展成为一个一流的材料会议。NSF基金用于资助学生和青年教师的旅行和固定费用，如果没有资金支持，他们将无法参加。电沉积戈登研究会议（GRC）是一个相对较新的会议，始于1996年。它起源于Read会议，这是自50年代初以来电沉积界的主要科学论坛之一。电沉积法作为一种标准的薄膜合成方法在新领域得到了广泛的应用。一个明显的例子是电子工业采用电沉积来形成VLSI中的Cu互连。此外，它在磁性材料、合金的形成和微机械零件的形成中也越来越重要。它可能发挥作用的新领域包括纳米制造和化合物半导体薄膜的形成

0070426StormElectrodeposition has been an important materials preparation technique since the turn of the century. The history of the Read Conference, and now the Electrodeposition GRC, has involved the formation of metals: Cu, Ag, Au, Cr and Ni, for car bumpers, contacts, electroforming, etc. The present organizers seek to change the focus of the conference from what is, to what could be. That is, the organizers feel the conference will have more impact if we can open up electrodeposition and investigate new, frontier, areas instead of discussing better ways to do what is already being done. Understanding of electrodeposition at the atomic scale has increased dramatically in recent years, as new analytical methods like scanning tunneling microscopy (STM) have been developed. This has resulted in improved control over processes, and the ability to use electrodeposition in areas where control over the nanometer scale is required. The present topic areas for the conference include copper electrodeposition in VLSI, magnetic materials, micro electromechanical systems (MEMS), semiconductors, surface characterization, and nanostructures. Under these headings, fundamental aspects of electrocrystallization, the effects of additives on morphological evolution of electrodeposited films, autocatalytic processes, and functional coatings which show promising wear and/or corrosion behavior will be discussed. The conference has seen dramatic growth from the first to the second, and we would like to develop it into a premier materials conference. The NSF funds are used to subsidize the travel and fixed fees of students and young faculty who would not be able to participate without financial support. %%%The Electrodeposition Gordon Research Conference (GRC) is relatively new, having started in 1996. It grew out of the Read Conference, one of the primary scientific forums for the electrodeposition community since the early 50's. Electrodeposition is becoming accepted as a standard thin film synthesis methodology in new areas. A clear example is the adoption of electrodeposition by the electronics industries to form Cu interconnects in VLSI. In addition, it is gaining importance in the formation of magnetic materials, alloys, and the formation of micromachined parts. New areas where it may play a roll include nanofabrication and the formation of compound semiconductor thin films.***