Developments of shafts with electrodes on both sides and integration of stimulation/recording electronics

这项研究提案是BIMEA项目中IWE 1工作的延续。应用项目的第一个目标是研制双面穿透轴电极。在BIMEA-Projekt项目中，IWE 1开发了穿透式三维微电极阵列，以电刺激神经细胞并记录视网膜中的神经元活动。这些阵列由最多四个单一的二维基本结构组成，每个结构最多有四个单轴，允许穿透视网膜和二维刺激和记录。这些电极只位于竖井的上侧。因此，在两个相对的轴之间进行直接刺激或记录是不可能的。通过实施额外的背面电极，相邻轴之间的相对电极的刺激将成为可能。第二个目标是集成集成的cmos芯片。在BIMEA项目中，B提案(Grabmaier/Kokozinski)开发了刺激和记录芯片。这些芯片将在项目开始时集成到承载基本电极结构的印刷电路板上。在林格溶液中对这些系统进行电气测试后，它们将被提供给项目合作伙伴进行生物实验。在该项目中，合作伙伴EBS将开发一种集刺激和记录电路于一身的单芯片解决方案。该芯片将在该项目的后期阶段推出。在这个项目中，这个芯片将直接连接到靠近电极的二维基础结构上。在林格溶液中进行电气测试后，这些系统将被移交给合作伙伴。此外，在BIMEA项目中开发的不同版本的三维微电极阵列将被制造、测试并在该项目开始时移交给合作伙伴进行生物实验。

This research proposal is a continuation of the work of IWE 1 in the project BIMEA. The first objective of the applied project is the development of double-sided penetrating shaft-electrodes. Within the BIMEA-Projekt IWE 1 developed penetrating three-dimensional microelectrode arrays to electrically stimulate nerve cells and to record neuron activities in the retina. These arrays are composed of up to four single two dimensional basis structures each having up to four single shafts that allow penetration into the retina and a two-dimensional stimulation and recording. These electrodes are only located on the upper side of a shaft. Therefor a direct stimulation or recoding between two opposite shafts is not possible. By implementing additional backside electrodes stimulation of opposite electrodes between neighbor shafts will be possible.A second objective will be the integration of the integrated CMOS-chips. In the BIMEA project within the proposal B (Grabmaier/Kokozinski) stimulation- and recording-chips were developed. These chips will be integrated in the beginning of this project onto the PCB that is carrying the basic electrode structures. After electrical testing of these systems in ringer solution they will be given to the project partners for biological experiments. Within this project partner EBS will develop a single chip solution having stimulation and recording circuitry all together. This chip will be available in a later phase of the project. Within this project this chip will be bonded directly onto a two-dimensional base structure in close vicinity to the electrodes. After electrical testing in ringer solution these systems will be handed over to the partners.In addition different versions of the three-dimensional microelectrode arrays developed within the BIMEA-project will be fabricated, tested and handed over in the beginning of this project to the partners for their biological experiments.