New Technology for the Environment: Environmentally-Conscious, Economically-Feasible Electronics Manufacturing

环保新技术：环保、经济可行的电子制造

• 批准号: 0086726
• 负责人: Mark Palmer
• 金额: $ 10万
• 依托单位: Virginia Commonwealth University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-09-15 至 2001-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0086726&HistoricalAwards=false
• 关键词: New; Technology; Environment; Environmentally; Conscious

This New Technologies for the Environment project will assess the feasibility of using lead-free solder with existing manufacturing equipment, through novel processing. Using this process may have the added benefit that fluxes, potentially hazardous organic materials, may be eliminated from the solder paste as well. Solder joints will be prepared by a solid state process, known as sintering where by powders are joined without melting the powder. Sintering is widely used to manufacture ceramics and high temperature metals. In the process proposed here, solders considered as alternatives to lead-tin solder will be heated to slightly below their melting point and allowed to sinter. Were these alternatives used in conventional processing, electronic materials would be exposed to temperatures 50C higher than if lead-tin were used. By sintering, the temperature will actually be reduced. This technique can also be used to form cold solder joints with mechanical integrity. This means that a wider range of materials can be considered.In this project students at VCU will prepare novel low flux solder pastes, form joints through sintering, and test their mechanical integrity. The mechanical integrity of these joints will be compared to those prepared by lead-tin solder.

这项针对环境项目的新技术将通过新颖的处理来评估将无铅焊料与现有制造设备一起使用的可行性。 使用此过程可能会带来额外的好处，即可能还可以从焊料糊中消除通量（潜在的危险有机材料）。 焊接接头将通过固态工艺制备，称为烧结，在其中连接了粉末，而不会熔化粉末。 烧结被广泛用于制造陶瓷和高温金属。在此处提出的过程中，被认为是铅锡焊料的替代品的焊料将被加热至略低于其熔点并允许烧结。 如果这些替代方案用于常规处理中，则电子材料将暴露于使用铅锡的温度高50c。 通过烧结，温度实际上将降低。 该技术还可以用于形成具有机械完整性的冷焊缝。这意味着可以考虑更大的材料。 这些关节的机械完整性将与铅锡焊料制备的接头进行比较。