New Technology for the Environment: Environmentally-Conscious, Economically-Feasible Electronics Manufacturing

环保新技术：环保、经济可行的电子制造

• 批准号: 0086726
• 负责人: Mark Palmer
• 金额: $ 10万
• 依托单位: Virginia Commonwealth University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-09-15 至 2001-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0086726&HistoricalAwards=false
• 关键词: New; Technology; Environment; Environmentally; Conscious

This New Technologies for the Environment project will assess the feasibility of using lead-free solder with existing manufacturing equipment, through novel processing. Using this process may have the added benefit that fluxes, potentially hazardous organic materials, may be eliminated from the solder paste as well. Solder joints will be prepared by a solid state process, known as sintering where by powders are joined without melting the powder. Sintering is widely used to manufacture ceramics and high temperature metals. In the process proposed here, solders considered as alternatives to lead-tin solder will be heated to slightly below their melting point and allowed to sinter. Were these alternatives used in conventional processing, electronic materials would be exposed to temperatures 50C higher than if lead-tin were used. By sintering, the temperature will actually be reduced. This technique can also be used to form cold solder joints with mechanical integrity. This means that a wider range of materials can be considered.In this project students at VCU will prepare novel low flux solder pastes, form joints through sintering, and test their mechanical integrity. The mechanical integrity of these joints will be compared to those prepared by lead-tin solder.

该环境新技术项目将评估通过新颖的加工工艺在现有制造设备上使用无铅焊料的可行性。 使用此工艺可能具有额外的好处，即焊膏中也可以消除助焊剂和潜在危险的有机材料。 焊点将通过固态工艺（称为烧结）制备，其中粉末在不熔化粉末的情况下连接。 烧结广泛用于制造陶瓷和高温金属。在此提出的工艺中，被视为铅锡焊料替代品的焊料将被加热至略低于其熔点并允许烧结。 如果这些替代品用于传统加工，电子材料将暴露在比使用铅锡高 50°C 的温度下。 通过烧结，温度实际上会降低。 该技术还可用于形成具有机械完整性的冷焊点。这意味着可以考虑更广泛的材料。在这个项目中，弗吉尼亚联邦大学的学生将制备新型低通量焊膏，通过烧结形成接头，并测试其机械完整性。 这些接头的机械完整性将与铅锡焊料制备的接头进行比较。