SBIR Phase II: Fabrication of Photonic Band Gap Structures Embedded in Low Temperature Co-fired Ceramic for Millimeter Wave Applications

这个小企业创新研究（SBIR）二期项目将开发用于微波电子的新材料。随着微波应用的扩展，包括便携式无线设备，以及数字集成电路速度和时钟速率增加到毫米波（MMW）范围，对微波/毫米波互连（EMIs）的低损耗元件的需求出现了，这些元件在广泛的频率范围和环境条件下具有均匀的特性。目前正在寻求一种新的技术，在制造的早期阶段将基于光子带隙结构（PBSs）的EMIs嵌入陶瓷衬底。PBSs将通过防止辐射泄漏和减少不必要的散射来减少使用低温共烧陶瓷金属技术制造的器件的辐射损失。其结果将是在不增加制造成本的情况下提高性能。第一阶段设计、制造和测试了基于pbs的emi，其中成功测试了具有低串扰的交叉波导。第二阶段将自动化设计和生产包括PBS EMIs在内的设备。该技术将通过基于PBS的毫米波天线的设计和制造进行演示。PBS将带来很多新的应用：频带控制滤波器、完美的通道下降滤波器、点缺陷谐振腔、线缺陷90度波导弯曲、低串扰波导交叉等等。该技术将应用于汽车雷达、航空电子设备和各种宽带无线通信设备等大批量生产产品。

This Small Business Innovation Research (SBIR) Phase II project will develop new materials engineered for microwave electronics. As microwave applications expand, including portable wireless devices, and as digital integrated circuit speeds and clock rates increase to the millimeter wave (MMW) range, the need arises for low-loss elements of microwave/MMW interconnects (EMIs) with properties uniform over a broad range of frequencies and environmental conditions. A new technique is now sought to embed EMIs based on Photonic Band Gap Structures (PBSs) in ceramic substrates at an early stage of fabrication. PBSs will reduce radiative losses in devices fabricated using the Low Temperature Co-fired Ceramic On Metal technique by preventing radiation leakage and by minimizing undesired scattering. The result will be improved performance, without increasing manufacturing costs. Phase I designed, fabricated, and tested PBS-based EMIs, wherein, cross waveguides with low cross talk were successfully tested. Phase II will automate the design and production of devices that include PBS EMIs. The technology will be demonstrated through the design and fabrication of a MMW antenna based on PBS.A PBS will lead to quite new applications: frequency-band controlled filters, perfect channel-drop filters, point-defect resonant cavities, line-defect ninety-degree waveguide bends, waveguide intersections with low crosstalk, and others. The new technique will be employed in high-volume production items for applications such as automotive radars, avionics, as well as in a variety of broadband wireless communication devices.