SBIR Phase II: Fabrication of Photonic Band Gap Structures Embedded in Low Temperature Co-fired Ceramic for Millimeter Wave Applications

这个小型企业创新研究(SBIR)第二阶段项目将开发用于微波电子产品的新材料。随着微波应用的扩展，包括便携式无线设备，以及随着数字集成电路速度和时钟频率提高到毫米波(MMW)范围，出现了对微波/毫米波互连(EMIS)的低损耗元件的需求，该元件在广泛的频率和环境条件下具有一致的特性。现在，人们正在寻求一种新的技术，在陶瓷基板的早期制造阶段嵌入基于光子带隙结构(PBSS)的EMIS。PBSS将通过防止辐射泄漏和最大限度地减少不需要的散射，减少使用低温共烧金属陶瓷技术制造的器件的辐射损失。其结果将是在不增加制造成本的情况下提高性能。第一阶段设计、制作和测试了基于PbS的EMIS，其中，成功地测试了低串扰的交叉波导。第二阶段将使包括PBS EMIS在内的设备的设计和生产自动化。这项技术将通过基于PBS的毫米波天线的设计和制造来展示。PBS将带来全新的应用：频带控制滤波器、完美的通道降滤波、点缺陷谐振腔、线缺陷90度波导弯曲、低串扰的波导交叉点等。这项新技术将用于汽车雷达、航空电子等应用的大批量生产项目，以及各种宽带无线通信设备。

This Small Business Innovation Research (SBIR) Phase II project will develop new materials engineered for microwave electronics. As microwave applications expand, including portable wireless devices, and as digital integrated circuit speeds and clock rates increase to the millimeter wave (MMW) range, the need arises for low-loss elements of microwave/MMW interconnects (EMIs) with properties uniform over a broad range of frequencies and environmental conditions. A new technique is now sought to embed EMIs based on Photonic Band Gap Structures (PBSs) in ceramic substrates at an early stage of fabrication. PBSs will reduce radiative losses in devices fabricated using the Low Temperature Co-fired Ceramic On Metal technique by preventing radiation leakage and by minimizing undesired scattering. The result will be improved performance, without increasing manufacturing costs. Phase I designed, fabricated, and tested PBS-based EMIs, wherein, cross waveguides with low cross talk were successfully tested. Phase II will automate the design and production of devices that include PBS EMIs. The technology will be demonstrated through the design and fabrication of a MMW antenna based on PBS.A PBS will lead to quite new applications: frequency-band controlled filters, perfect channel-drop filters, point-defect resonant cavities, line-defect ninety-degree waveguide bends, waveguide intersections with low crosstalk, and others. The new technique will be employed in high-volume production items for applications such as automotive radars, avionics, as well as in a variety of broadband wireless communication devices.