Ultra-High-Capacity Optical Communications and Networking: Optoelectronic Integrated Packaging Technology for High Date Rate Optical Communications

本提案是应NSF 01-65关于“超大容量光通信和网络”的征集而提交的。先进的数据和电信通信系统将需要开发和集成各种硬件技术(如光纤、集成光学、电子学和MEMS)，以实现可靠的功能，并满足大容量和高数据速率吞吐量。过去，最好的设计在研究实验室表现出了巨大的前景，但一旦包装起来，反应就会降级。光电子器件的设计是复杂的，通过将电子设计从光学设计方面解耦而得到简化。在高数据速率下，未解决的电气问题可能会导致光学响应显著降低。在未来，必须在器件和封装设计中将机械和电气问题联系在一起，以缩短设计周期和成本，从而提高封装器件的性能。因此，成功开发50Gbps以上的高数据速率系统将需要开发在光电子设计中提供透明封装集成的方法。高速光电子设计的一个关键问题是开发以光学为中心的电子设计方法。鉴于目前高速电子设计方面的知识，这种联合设计方法现在是可能的。这项研究致力于研究高速电子互连设计和集成到器件和光电封装中的“共同设计”方法的发展。这项研究的影响可能为光子技术提供革命性的封装设计方法，从而可能导致第一个“集成”的光电子封装设计技术的发展。在本研究期间，我们寻求了两个目标。目的1研究用于光电子器件的高隔离度高速电互连的设计。目标2旨在研究透明光电子封装集成的协同设计方法的发展。围绕互连和封装这两个主题，我们建议将硅微机械加工技术作为一种媒介，将光学微台封装技术与高性能互连设计相结合，形成新型高速集成封装。我们将通过以下研究问题来实现我们的目标：第一是用于将激光器封装到硅光学微台技术中的隔离和高密度设计的互连研究。第二个是用于光调制器的封装行波电极的研究。三是低温共烧陶瓷(LTCC)基板上硅微台技术的异质封装集成研究，以提供高频连接器与硅微台之间的信号传输。这一研究项目将为培训下一代高频工程师提供重要的经验和知识，使他们能够在具有高数据速率电子接口的光学器件的协同设计方法方面进行培训。

This proposal was submitted in response to the solicitation NSF 01-65 on "Ultra-High Capacity Optical Communications and Networking." Advanced data and telecom communication systems will require development and integration of diverse hardware technologies (e.g. fiber optics, integrated optics, electronics, and MEMs) to achieve reliable functionality and to satisfy large capacity and high data rate throughput. In the past, the best designs have shown great promise in the research lab, but have demonstrated degraded response once packaged. Optoelectronic device design is complex and has been simplified by de-coupling the electronic design from the optical aspect of design. At high data rates, unresolved electrical issues can result in significant optical response degradation. In the future both mechanical and electrical issues must be linked together in device and package design to offer an improved performance of packaged devices with reduced design cycle time and cost. Hence, successful development of high data rate systems above 50 Gbps will require development of approaches to offer transparent package integration in optoelectronic (OE)design.A key issue for high-speed optoelectronic design is development of optics-centered electronic design methods. Such co-design methods are now possible, given the current knowledge in high-speed electronic design. This research seeks to investigate the development of "co-design" methods for the design and integration of high speed electronic interconnects into device and optoelectronic packages. The impact of this research could provide revolutionary package design methods for photonic technology that could lead to the development of the first "integrated" optoelectronic package design techniques. Two objectives are sought during this research period. Objective 1 seeks to investigate the design of high speed electrical interconnects with high isolation for optoelectronic devices. Objective 2 seeks to investigate the development of co-design approaches for transparent optoelectronic package integration. Focusing on two topics - interconnects and packaging, we propose to investigate the use of silicon micromachining techniques as a vehicle for combining optical microbench packaging technology with high performance interconnect design to form novel high speed integrated packages. We will achieve our objectives by working on the following research problems: The first is an interconnect study for isolated and high-density designs used to package lasers into the silicon optical microbench technology. The second is a packaged traveling wave electrode study for use in optical modulator applications. The third is integration study for heterogeneous packaging of Si microbench technology in low temperature co-fired ceramic (LTCC) substrate boards to provide signal transfer between high frequency connectors and the silicon micro-bench. This research project will provide important experience and knowledge for training the next generation of high frequency engineers in co-design methods for optics with high data rate electronic interfaces.