Ultra-High-Capacity Optical Communications and Networking: Optoelectronic Integrated Packaging Technology for High Date Rate Optical Communications

超高容量光通信与网络：高速率光通信的光电集成封装技术

• 批准号: 0123497
• 负责人: Rhonda Franklin
• 金额: $ 30万
• 依托单位: University of Minnesota-Twin Cities
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2001
• 资助国家: 美国
• 起止时间: 2001-09-15 至 2006-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0123497&HistoricalAwards=false
• 关键词: Ultra; Capacity; Optical; Communications; Networking

This proposal was submitted in response to the solicitation NSF 01-65 on "Ultra-High Capacity Optical Communications and Networking." Advanced data and telecom communication systems will require development and integration of diverse hardware technologies (e.g. fiber optics, integrated optics, electronics, and MEMs) to achieve reliable functionality and to satisfy large capacity and high data rate throughput. In the past, the best designs have shown great promise in the research lab, but have demonstrated degraded response once packaged. Optoelectronic device design is complex and has been simplified by de-coupling the electronic design from the optical aspect of design. At high data rates, unresolved electrical issues can result in significant optical response degradation. In the future both mechanical and electrical issues must be linked together in device and package design to offer an improved performance of packaged devices with reduced design cycle time and cost. Hence, successful development of high data rate systems above 50 Gbps will require development of approaches to offer transparent package integration in optoelectronic (OE)design.A key issue for high-speed optoelectronic design is development of optics-centered electronic design methods. Such co-design methods are now possible, given the current knowledge in high-speed electronic design. This research seeks to investigate the development of "co-design" methods for the design and integration of high speed electronic interconnects into device and optoelectronic packages. The impact of this research could provide revolutionary package design methods for photonic technology that could lead to the development of the first "integrated" optoelectronic package design techniques. Two objectives are sought during this research period. Objective 1 seeks to investigate the design of high speed electrical interconnects with high isolation for optoelectronic devices. Objective 2 seeks to investigate the development of co-design approaches for transparent optoelectronic package integration. Focusing on two topics - interconnects and packaging, we propose to investigate the use of silicon micromachining techniques as a vehicle for combining optical microbench packaging technology with high performance interconnect design to form novel high speed integrated packages. We will achieve our objectives by working on the following research problems: The first is an interconnect study for isolated and high-density designs used to package lasers into the silicon optical microbench technology. The second is a packaged traveling wave electrode study for use in optical modulator applications. The third is integration study for heterogeneous packaging of Si microbench technology in low temperature co-fired ceramic (LTCC) substrate boards to provide signal transfer between high frequency connectors and the silicon micro-bench. This research project will provide important experience and knowledge for training the next generation of high frequency engineers in co-design methods for optics with high data rate electronic interfaces.

该提案是应NSF 01-65“超高容量光通信和网络”的要求提交的。“先进的数据和电信通信系统将需要开发和集成各种硬件技术（例如光纤、集成光学、电子和MEMS），以实现可靠的功能，并满足大容量和高数据速率吞吐量。在过去，最好的设计在研究实验室中表现出很大的希望，但一旦封装，就会表现出降级的响应。光电子器件设计是复杂的，并且已经通过将电子设计与设计的光学方面解耦来简化。在高数据速率下，未解决的电气问题可能导致显著的光学响应降级。在未来，在器件和封装设计中必须将机械和电气问题联系在一起，以提供封装器件的改进性能，同时减少设计周期和成本。因此，要成功开发50 Gbps以上的高速数据传输系统，就需要在光电子设计中提供透明的封装集成。高速光电子设计的一个关键问题是发展以光为中心的电子设计方法。鉴于高速电子设计的现有知识，这种协同设计方法现在是可能的。本研究旨在探讨发展的“协同设计”方法的设计和集成的高速电子互连到设备和光电封装。这项研究的影响可能会为光子技术提供革命性的封装设计方法，这可能会导致第一个“集成”光电封装设计技术的发展。本研究期间有两个目标。目标1：研究光电器件高速高隔离度电互连线的设计。目标2旨在研究透明光电封装集成协同设计方法的发展。聚焦于两个主题-互连和封装，我们建议调查使用硅微机械加工技术相结合的高性能互连设计，形成新型的高速集成封装的光学微工作台封装技术的车辆。我们将通过以下研究问题来实现我们的目标：第一个是用于将激光器封装到硅光学微工作台技术中的隔离和高密度设计的互连研究。第二个是用于光调制器应用的封装行波电极研究。第三个是集成研究的异质封装的硅微工作台技术在低温共烧陶瓷（LTCC）基板，以提供高频连接器和硅微工作台之间的信号传输。该研究项目将为培训下一代高频工程师提供重要的经验和知识，用于高数据速率电子接口的光学协同设计方法。