Ultra-High-Capacity Optical Communications and Networking: Optoelectronic Integrated Packaging Technology for High Date Rate Optical Communications

超高容量光通信与网络：高速率光通信的光电集成封装技术

• 批准号: 0123497
• 负责人: Rhonda Franklin
• 金额: $ 30万
• 依托单位: University of Minnesota-Twin Cities
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2001
• 资助国家: 美国
• 起止时间: 2001-09-15 至 2006-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0123497&HistoricalAwards=false
• 关键词: Ultra; Capacity; Optical; Communications; Networking

This proposal was submitted in response to the solicitation NSF 01-65 on "Ultra-High Capacity Optical Communications and Networking." Advanced data and telecom communication systems will require development and integration of diverse hardware technologies (e.g. fiber optics, integrated optics, electronics, and MEMs) to achieve reliable functionality and to satisfy large capacity and high data rate throughput. In the past, the best designs have shown great promise in the research lab, but have demonstrated degraded response once packaged. Optoelectronic device design is complex and has been simplified by de-coupling the electronic design from the optical aspect of design. At high data rates, unresolved electrical issues can result in significant optical response degradation. In the future both mechanical and electrical issues must be linked together in device and package design to offer an improved performance of packaged devices with reduced design cycle time and cost. Hence, successful development of high data rate systems above 50 Gbps will require development of approaches to offer transparent package integration in optoelectronic (OE)design.A key issue for high-speed optoelectronic design is development of optics-centered electronic design methods. Such co-design methods are now possible, given the current knowledge in high-speed electronic design. This research seeks to investigate the development of "co-design" methods for the design and integration of high speed electronic interconnects into device and optoelectronic packages. The impact of this research could provide revolutionary package design methods for photonic technology that could lead to the development of the first "integrated" optoelectronic package design techniques. Two objectives are sought during this research period. Objective 1 seeks to investigate the design of high speed electrical interconnects with high isolation for optoelectronic devices. Objective 2 seeks to investigate the development of co-design approaches for transparent optoelectronic package integration. Focusing on two topics - interconnects and packaging, we propose to investigate the use of silicon micromachining techniques as a vehicle for combining optical microbench packaging technology with high performance interconnect design to form novel high speed integrated packages. We will achieve our objectives by working on the following research problems: The first is an interconnect study for isolated and high-density designs used to package lasers into the silicon optical microbench technology. The second is a packaged traveling wave electrode study for use in optical modulator applications. The third is integration study for heterogeneous packaging of Si microbench technology in low temperature co-fired ceramic (LTCC) substrate boards to provide signal transfer between high frequency connectors and the silicon micro-bench. This research project will provide important experience and knowledge for training the next generation of high frequency engineers in co-design methods for optics with high data rate electronic interfaces.

该提案是为了响应关于“超高容量光通信和网络”的 NSF 01-65 号征集而提交的。先进的数据和电信通信系统需要开发和集成不同的硬件技术（例如光纤、集成光学、电子和 MEM），以实现可靠的功能并满足大容量和高数据速率吞吐量。过去，最好的设计在研究实验室中表现出了巨大的前景，但一旦包装起来，反应就会下降。光电器件设计非常复杂，通过将电子设计与光学设计分离来简化。在高数据速率下，未解决的电气问题可能会导致光学响应显着下降。未来，机械和电气问题必须在器件和封装设计中联系在一起，以提高封装器件的性能，同时缩短设计周期时间和成本。因此，成功开发超过 50 Gbps 的高数据速率系统将需要开发在光电 (OE) 设计中提供透明封装集成的方法。高速光电设计的一个关键问题是开发以光学为中心的电子设计方法。鉴于目前高速电子设计的知识，这种协同设计方法现在是可能的。本研究旨在研究“协同设计”方法的发展，用于将高速电子互连设计和集成到设备和光电封装中。这项研究的影响可以为光子技术提供革命性的封装设计方法，从而导致第一个“集成”光电封装设计技术的发展。本研究期间寻求两个目标。目标 1 旨在研究光电器件的高隔离度高速电气互连的设计。目标 2 旨在研究透明光电封装集成协同设计方法的开发。围绕互连和封装这两个主题，我们建议研究使用硅微加工技术作为将光学微工作台封装技术与高性能互连设计相结合以形成新型高速集成封装的工具。我们将通过解决以下研究问题来实现我们的目标：第一个是用于将激光器封装到硅光学微平台技术中的隔离和高密度设计的互连研究。第二个是用于光调制器应用的封装行波电极研究。第三个是低温共烧陶瓷（LTCC）基板中硅微工作台技术异构封装的集成研究，以提供高频连接器和硅微工作台之间的信号传输。该研究项目将为培训下一代高频工程师在高数据速率电子接口光学器件的协同设计方法方面提供重要的经验和知识。