SBIR Phase I: Reactive Mounting of Heat Sinks

SBIR 第一阶段：散热器的反应式安装

• 批准号: 0215109
• 负责人: Timothy Weihs
• 金额: $ 10万
• 依托单位: REACTIVE NANOTECHNOLOGIES INC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-07-01 至 2002-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0215109&HistoricalAwards=false
• 关键词: SBIR; Phase; Reactive; Mounting; Heat

This Small Business Innovation Research (SBIR) Phase I project seeks to develop a rapid, heat sink mounting technology that produces a metallic bond between the heat sink and the microelectronic device. The metallic bond is far superior to current mounting technologies in its thermal conduction and its mechanical strength. The proposed technology for mounting heat sinks onto substrates and chips is a reactive joining process that uses reactive multilayer foils as local heat sources for melting solders or brazes. The foils are a new class of nano-engineered materials, in which self- propagating exothermic reactions can be ignited at room temperature with a spark. By inserting a multilayer foil between two solder (or braze) layers and two components, heat generated by the reaction in the foil melts the solder and consequently bonds the components. This new method of soldering eliminates the need for a furnace and, with very localized heating, avoids thermal damage to the microelectronic device. The resulting metallic joints are stronger and far more thermally conductive than common, commercial mounting technologies (greases, pads and epoxies). The reactive bonding process is also far more rapid than most of these technologies, offering substantial savings in processing time and convenience. Phase I research will (1) demonstrate the feasibility of this mounting process, (2) characterize the thermal and mechanical properties of the resulting interfaces, and (3) develop a model that predicts thermal exposure of devices during the reactive mounting process.Successful development of this reactive mounting technology will advance the thermal management of microelectronic devices, and it will help accelerate future improvements in the performance of these devices. The world wide market for thermal management solutions is about $3.7 billion, with most of this market being outsourced. The trends in the computer industry are towards smaller devices with higher power dissipation, increasing the need for superior thermal management.

这个小型企业创新研究(SBIR)第一阶段项目寻求开发一种快速的散热片安装技术，在散热片和微电子设备之间产生金属粘合。这种金属结合剂在导热性和机械强度方面远远优于目前的贴装技术。建议的将散热器安装到基板和芯片上的技术是一种反应性连接工艺，它使用反应性多层箔作为熔化焊料或铜焊的局部热源。铝箔是一种新型的纳米工程材料，它可以在室温下用火花点燃自蔓延放热反应。通过在两个焊料(或铜焊)层和两个部件之间插入多层箔，箔中的反应产生的热量融化了焊料，从而将部件粘合在一起。这种新的焊接方法消除了对炉子的需要，并且通过非常局部的加热，避免了对微电子设备的热损害。由此产生的金属接头比常见的商业安装技术(润滑脂、垫片和环氧树脂)更坚固，导热性更强。反应键合过程也比大多数这些技术快得多，大大节省了加工时间和便利性。第一阶段的研究将(1)论证这种贴装工艺的可行性，(2)表征所产生的界面的热和机械性质，以及(3)开发一个模型来预测在反应式贴装过程中器件的热暴露。这种反应式贴装技术的成功开发将促进微电子器件的热管理，并将有助于加速这些器件的未来性能的改进。全球热管理解决方案的市场规模约为37亿美元，其中大部分被外包。计算机行业的趋势是更小的设备具有更高的功耗，这增加了对高级热管理的需求。