SBIR Phase I: Reactive Multilayer Joining of Metals and Ceramics

SBIR 第一阶段：金属和陶瓷的反应多层连接

• 批准号: 0232395
• 负责人: Timothy Weihs
• 金额: $ 10万
• 依托单位: REACTIVE NANOTECHNOLOGIES INC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-01-01 至 2003-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0232395&HistoricalAwards=false
• 关键词: SBIR; Phase; Reactive; Multilayer; Joining

This Small Business Innovation Research (SBIR) Phase I project will develop a new joining technology that will provide substantial technical and cost advantages for multiple industrial applications, including metal-to-metal and metal-to-ceramic joining. The technology for joining metallic and ceramic components is a reactive joining process that uses reactive multilayer foils as local heat sources for melting solders or brazes. The foils are a new class of nano-engineered materials, in which self-propagating exothermic reactions can be ignited at room temperature with a spark. By inserting a multilayer foil between two solder (or braze) layers and two components, heat generated by the reaction in the foil melts the solder and consequently bonds the components. This new method of soldering eliminates the need for a furnace and, with very localized heating, avoids thermal damage to the components. The commercial potential of this reactive bonding process is more rapid than most competing technologies, and results in strong and cost-effective joints.

该小型企业创新研究 (SBIR) 第一阶段项目将开发一种新的连接技术，该技术将为多种工业应用（包括金属对金属和金属对陶瓷的连接）提供显着的技术和成本优势。连接金属和陶瓷部件的技术是一种反应性连接工艺，使用反应性多层箔作为熔化焊料或铜焊料的局部热源。这些箔片是一类新型纳米工程材料，其中自蔓延放热反应可以在室温下用火花点燃。通过在两个焊料（或铜焊）层和两个组件之间插入多层箔，箔中反应产生的热量会熔化焊料，从而粘合组件。这种新的焊接方法不需要熔炉，并且通过非常局部的加热，避免了对元件的热损坏。这种反应性粘合工艺的商业潜力比大多数竞争技术更快，并且可以产生坚固且具有成本效益的接头。