US-Turkey Cooperative Research: Computer-Aided Knowledge-Based Process Planning for Surface Mount Rework

0215760 Fidan描述：该奖项是为了支持田纳西州库克维尔的田纳西技术大学制造和工业工程系的Ismail Fidan教授和土耳其伊斯坦布尔的伊斯坦布尔技术大学机械工程系的塞尔达尔图姆科尔博士的合作项目。 他们计划开发一个交互式的基于知识的电路板缺陷专家接口系统。 在表面贴装组装中，高引脚数高密度封装的趋势突出了这些极细间距器件的组装线中的固有困难。在印刷电路板组装（PCBA）技术中，需要返工的各种缺陷仍然很常见。产品复杂性的增加、元件尺寸的减小以及双面电路板的使用使得返工变得更加困难，而经济的PCBA返工是PCB制造商面临的主要问题之一。 PCBA制造业已经相对改善了全自动化，精确的装配机器和机器人的使用，但已经表明，自动化返工线的结果没有产生足够高的可靠良率。 该奖项的目的是为表面贴装返工做出贡献。 随着这个知识为基础的系统的发展，返工将被删除的PCBA线，和PCBA工艺参数，这会导致联合级的可靠性问题，将管理在线与开发system.Scope的帮助下：专家接口系统的电子板，调查人员计划开发可能是一个具有成本效益的解决方案，用于检测和纠正电子制造商的缺陷。 对“表面贴装返工的计算机辅助工艺规划”的潜在贡献可能是对电子制造领域的重要补充，通过最小化电子印刷线路板的缺陷和浪费的数量。 所开发的系统及其实现也可用于工业自动化和计算机集成制造研究生课程的高级和研究生课程。 该项目的资金由国际科学与工程办公室和设计、制造和工业创新司提供。

0215760FidanDescription: This award is for support of a cooperative project by Professor Ismail Fidan, Department of Manufacturing and Industrial Engineering at Tennessee Technical University, Cookeville, Tennessee and Dr. Serdar Tumkor, Mechanical Engineering Department at Istanbul Technical University, Istanbul, Turkey. They plan to develop an interactive knowledge based expert interface system of circuit board defects. The trend to high pin-count high-density packaging in surface mount assembly has highlighted inherent difficulties in the assembly line of these very fine pitch devices. A variety of defects is still common in printed circuit board assembly (PCBA) technology requiring rework. Increasing product complexity, decreasing component size, and using double sided boards have made rework more difficult and the economic reworking of PCBAs is one of the main problems facing PCB manufacturers. PCBA manufacturing has been relatively improved with fully automated, accurate assembly machines and the use of robots but it has been shown that the outcomes of the automated rework line have not produced a high enough level of the reliable yield percentage. The objective of this award is to make a contribution towards this surface mount rework. With the development of this knowledge-based system, the rework will be removed from the PCBA line, and PCBA process parameters, which cause joint level reliability problems, will be managed online with the help of the developed system.Scope: The expert interface system for electronic boards that the investigators plan to develop may be a cost-effective solution for detecting and correcting flaws in electronics manufacturers. The potential contributions into "computer-aided process planning for surface mount rework" may be a significant addition to the electronics manufacturing field by minimizing the number of the defects and waste of the electronics printed wiring boards. The developed system and its implementations may also be used in the senior and graduate level courses in industrial automation and in computer integrated manufacturing graduate courses. Funds for this project are provided by the Office of International Science and Engineering and the Division of Design, Manufacturing, and Industrial Innovation.