US-Turkey Cooperative Research: Computer-Aided Knowledge-Based Process Planning for Surface Mount Rework

0215760Fidan描述：该奖项是为了表彰田纳西库克维尔田纳西技术大学制造和工业工程系Ismail Fidan教授和土耳其伊斯坦布尔技术大学机械工程系Serdar Tumkor博士的合作项目。他们计划开发一个基于交互式知识的电路板缺陷专家界面系统。在表面贴装组装中，高引脚数高密度封装的趋势突显了这些非常细间距器件的装配线上的固有困难。在需要返工的印刷电路板组装(PCBA)工艺中，各种缺陷仍然很常见。产品复杂性的增加、元器件尺寸的减小以及双面板的使用使得返工变得更加困难，而PCBA的经济返工是印刷电路板制造商面临的主要问题之一。随着全自动、精确的装配机和机器人的使用，PCBA的制造得到了相对改善，但已经表明，自动化返工生产线的结果并没有产生足够高的可靠良率百分比。该奖项的目的是为表面贴装返工做出贡献。随着这个基于知识的系统的开发，将消除PCBA生产线上的返工，并利用所开发的系统在线管理导致连接级可靠性问题的PCBA工艺参数。范围：调查人员计划开发的电子板专家接口系统可能是检测和纠正电子制造商缺陷的一种经济有效的解决方案。通过最大限度地减少电子印制线路板的缺陷和浪费的数量，这项潜在的贡献可能会对电子制造领域产生重大的影响。所开发的系统及其实现也可用于工业自动化高级和研究生课程以及计算机集成制造研究生课程。该项目的资金由国际科学与工程办公室和设计、制造和工业创新司提供。

0215760FidanDescription: This award is for support of a cooperative project by Professor Ismail Fidan, Department of Manufacturing and Industrial Engineering at Tennessee Technical University, Cookeville, Tennessee and Dr. Serdar Tumkor, Mechanical Engineering Department at Istanbul Technical University, Istanbul, Turkey. They plan to develop an interactive knowledge based expert interface system of circuit board defects. The trend to high pin-count high-density packaging in surface mount assembly has highlighted inherent difficulties in the assembly line of these very fine pitch devices. A variety of defects is still common in printed circuit board assembly (PCBA) technology requiring rework. Increasing product complexity, decreasing component size, and using double sided boards have made rework more difficult and the economic reworking of PCBAs is one of the main problems facing PCB manufacturers. PCBA manufacturing has been relatively improved with fully automated, accurate assembly machines and the use of robots but it has been shown that the outcomes of the automated rework line have not produced a high enough level of the reliable yield percentage. The objective of this award is to make a contribution towards this surface mount rework. With the development of this knowledge-based system, the rework will be removed from the PCBA line, and PCBA process parameters, which cause joint level reliability problems, will be managed online with the help of the developed system.Scope: The expert interface system for electronic boards that the investigators plan to develop may be a cost-effective solution for detecting and correcting flaws in electronics manufacturers. The potential contributions into "computer-aided process planning for surface mount rework" may be a significant addition to the electronics manufacturing field by minimizing the number of the defects and waste of the electronics printed wiring boards. The developed system and its implementations may also be used in the senior and graduate level courses in industrial automation and in computer integrated manufacturing graduate courses. Funds for this project are provided by the Office of International Science and Engineering and the Division of Design, Manufacturing, and Industrial Innovation.