GOALI - The Effect of Changing to Pb Free Solders on Manufacturing Processes: Evolution of Solder Joint Microstructure

GOALI - 改用无铅焊料对制造工艺的影响：焊点微观结构的演变

• 批准号: 0218129
• 负责人: Eric Cotts
• 金额: $ 36万
• 依托单位: SUNY at Binghamton
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-09-01 至 2006-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0218129&HistoricalAwards=false
• 关键词: GOALI; Effect; Changing; Pb; Free

This GOALI project is a collaboration with Universal Instruments Corporation to study how a transition to lead (Pb)-free solders will affect manufacturing processes for electronic packaging. A comprehensive treatment of solder joint reliability requires at least three major research efforts: (1) Development of a fundamental understanding of solder joint microstructure (grain size/structure, phase regions, intermetallics), including the ability to predict microstructure at any given time during any given thermal history. (2) Development of constitutive relations which quantify deformation properties as functions of temperature, strain rate, and detailed microstructure. (3) Development of damage functions that quantify the progression of damage for given temperature, strain/stress (or integrated functions thereof such as ductility exhaustion) and microstructure. In principle, after characterizing these relations, establishing a predictive capability for the mechanical behavior and reliability of Pb free solder joints is relatively straightforward, although extensive, mechanical modeling is required. This capability would allow the prediction of accelerated test results for specific solder based assemblies, as well as the interpretation of experimental results and extrapolation to service conditions. However, without the ability to predict the variation of important aspects of the microstructure over the history of the joint, efforts 2 and 3 above become at best semi-empirical and highly questionable for purposes of extrapolation. Particular complications are the effects of the progress of damage and the (often cyclic) effects of the thermal mismatch induced deformations. This project addresses significant issues related to environmentally benign manufacturing, with specific emphasis on manufacturing electronics. It is expected that advancements in fundamental knowledge of material behavior and processing of this material substitution will be made. There is direct involvement of undergraduate and graduate students through both research and an educational component, strengthen by the industrial collaboration.

这个GOALI项目是与通用仪器公司合作，研究无铅（Pb）焊料的过渡将如何影响电子封装的制造工艺。焊点可靠性的综合处理至少需要三个主要的研究工作：（1）发展对焊点微观结构（晶粒尺寸/结构，相区，金属间化合物）的基本理解，包括在任何给定的热历史期间的任何给定时间预测微观结构的能力。(2)本构关系的发展，量化变形性能作为温度，应变速率和详细的微观结构的函数。(3)开发损伤函数，量化给定温度、应变/应力（或其综合函数，如延性耗尽）和微观结构的损伤进展。原则上，在表征这些关系之后，建立无铅焊点的机械行为和可靠性的预测能力是相对简单的，尽管需要广泛的机械建模。这种能力将允许预测特定焊料组件的加速测试结果，以及解释实验结果和外推到服务条件。然而，由于没有能力预测接头历史中微观结构重要方面的变化，因此上述努力2和3充其量只能是半经验的，并且对于外推的目的来说是非常有问题的。特别复杂的是损伤的进展的影响和（通常是循环的）热失配引起的变形的影响。该项目涉及与环境友好型制造有关的重大问题，特别强调制造电子产品。预计将在材料行为和这种材料替代物的加工的基础知识方面取得进展。本科生和研究生通过研究和教育部分直接参与，并通过工业合作加强。