RUI: Formulation for Coupled Composition-Thermoelectromechanics in Polycrystalline Thin Film Structures

Ri：多晶薄膜结构中的组成-热电耦合公式Lori C.Bassman组成微电子互连的薄膜金属线在热条件下有很大的变化。在制造过程中，不同温度下的加工步骤会产生微不足道的热应力，在工作条件下，通过焦耳加热产生的热量会使管线承受较高的温度。该项目的重点是将空间温度变化的影响以及电导纳入到晶格级模型中，用于研究薄膜多晶材料的耦合组成和机理。在一般的多晶域上解决组合、力学、电气和热问题的能力将为更好地理解发生在越来越小的互连结构中的物理现象提供机会。它还将提高在与微电子工业相关的各种晶体材料中研究这些现象的一般能力。这个项目的所有方面，包括公式的扩展，使用专门的数值方法在有限元代码中实施，以及用文献中的实验研究验证模型，都将得到哈维马德学院本科生的大量参与。

RUI: Formulation for Coupled Composition-Thermoelectromechanics inPolycrystalline Thin Film StructuresLori C. BassmanThe thin film metal lines that comprise microelectronic interconnectsexperience large variations in thermal conditions. Duringfabrication, processing steps at different temperatures result insignificant thermal stresses, and under operating conditions the heatgenerated through Joule heating subjects the lines to elevatedtemperatures. The focus of this project is to incorporate the effectsof spatially varying temperature, along with electrical conduction,into a lattice-level model for the coupled composition and mechanicsof thin film polycrystalline materials. The ability to solve coupledcomposition, mechanics, electrical, and thermal problems on a generalpolycrystalline domain will provide opportunities for greaterunderstanding of the physical phenomena occurring in ever-smallerinterconnect structures. It also will enhance general capability tostudy these phenomena in a variety of crystalline materials relevantto the microelectronics industry. All facets of this project,including expansion of the formulation, implementation in a finiteelement code using specialized numerical methods, and validation ofthe model with experimental studies from the literature, are to becompleted with substantial participation of undergraduate students atHarvey Mudd College.