Transmission Laser Bonding for MEMS Packaging

用于 MEMS 封装的透射激光键合

• 批准号: 0423457
• 负责人: Ampere Tseng
• 金额: $ 6.2万
• 依托单位: Arizona State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2004
• 资助国家: 美国
• 起止时间: 2004-08-15 至 2006-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0423457&HistoricalAwards=false
• 关键词: Transmission; Laser; Bonding; MEMS; Packaging

The objective of this research is to advance a wafer-bonding technique, called the transmission laser bonding, to be reliable and applicable for packaging of microelectromechanical devices. The approach is to use both experimental and numerical schemes to study the physical and chemical phenomena in the bonding region during and after bonding at micro- and nano-scale levels. Using characteristics of laser and the associated optical properties, the technique can efficiently bond a transparent wafer, such as glass, to an opaque substrate, such as silicon, by laser melting of a thin layer near the interface.With the successful accomplishment of the proposed research, the potential cost saving and quality enhancement on microdevice packaging will be significant. Since packaging cost represents more than fifty percent of the total device cost, the proposed research should be extremely important to the associated industry. Currently, the applications of these microdevice products have been extended from the traditional automotive and aerospace sectors to many emerging markets, including consumer electronics, biomedical, and information; the products should have major impact directly or indirectly on people's daily life. Furthermore, the knowledge base gained from the proposed investigation can greatly improve the fundamental understanding of many areas involved, including the surface and materials sciences, mechanics, heat transfer, and fluid flow, as well as the bonding technology as a whole. The proposed approach should educate students to have sound basic knowledge with good balance between fundamental research and application in studying packaging.

本研究的目的是提出一种晶圆键合技术，称为透射激光键合，是可靠的，适用于微机电器件的封装。该方法是使用实验和数值计算方案来研究键合过程中和键合后在微米和纳米尺度上的物理和化学现象。该技术利用激光的特性和相关的光学性质，通过激光熔化透明晶片（如玻璃）和不透明衬底（如硅）的界面附近的薄层，有效地将透明晶片（如玻璃）键合到不透明衬底（如硅）上，随着该研究的成功完成，微器件封装的潜在成本节约和质量提高将是显著的。由于封装成本占总器件成本的50%以上，因此所提出的研究对相关行业非常重要。目前，这些微器件产品的应用已从传统的汽车和航空航天领域扩展到消费电子、生物医药和信息等新兴市场，产品将直接或间接地对人们的日常生活产生重大影响。 此外，从拟议的调查中获得的知识库可以大大提高对所涉及的许多领域的基本理解，包括表面和材料科学，力学，传热和流体流动，以及整个键合技术。所提出的方法应教育学生有良好的基础知识与基础研究和应用之间的良好平衡，在学习包装。