SBIR Phase I: Compression Bonded Hermetic Packaging

该小型企业创新研究第一阶段项目旨在开发两种版本的压缩接合技术-冷流密封和冷焊-用于MEMS的室温密封封装。该项目解决了MEMS行业的关键需求，该行业缺乏通用的低成本密封封装技术，阻碍了许多新MEMS类型的开发。室温封装对于提高许多MEMS，特别是光学MEMS（MEOMS）的生产良率至关重要。项目将测试可用于两种方法（如上所述）的低屈服强度和中等屈服强度材料组合，并在小包装中展示概念。这项技术的广泛影响可能会导致焊接和连接工艺知识库的显着增加，特别是当它们应用于微观尺度时。美国目前在MEMS技术方面处于领先地位，该项目可能有助于保持这一领先地位。

This Small Business Innovation Research Phase I project aims to develop a compression bonding technology in two versions -- cold flow seals and cold welding -- for room-temperature, hermetic packaging of MEMS. This project addresses key needs in the MEMS industry, where the lack of versatile, low-cost hermetic packaging techniques is holding back the development of many new MEMS types. Room temperature packaging is vital to improving the production yields of many MEMS, especially optical MEMS (MEOMS). Project will test the low and medium yield strength materials combinations that could be used in the two approaches (mentioned above) and to demonstrate the concept in small packages. The broader impacts from this technology could result in a significant increase to the knowledge base of welding and joining processes, especially as they apply on the micro-scale. The U.S. currently leads in MEMS technology and this project could help maintain that lead.