Control of the laser induced temperature field for the ralisation of a compact machining module for planar laser material processing

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In the course of miniaturization, the importance of the industrial production of metallic microcomponents steadily increases. The size of the machines for the manufacture of such components stands in gross disproportion to the component size. The achievable accuracy is limited by inaccuracies of mechanical positioning elements and external disturbances such as vibration and thermal distortion. Laser chemical removal enables a contactless machining of metals using a comparatively low laser power density. Through the use of a micro-mirror array (DMD) for flexible beam shaping a 2-dimensional machining of the workpiece is possible. In laser material processing DMDs were due to their low damage threshold but not yet used. The laser chemical machining method used in this project should now allow for the first time to connect the DMD technology with laser-based micromachining. The aim of this project is to realized and characterise on the basis of the previously implemented laboratory prototype and the so won scientific and technical knowledge for the planar laser chemical micro material removal a compact processing module, which is desensitive to external disturbances and can be combined with other modules for a qualified use in microfabrication.