Proposal To Support Student Attendance at the IEEE International Conference on Shape Modeling and Applications

2005年6月，麻省理工学院主办并共同赞助了国际形状和固体大会(网址：http://deslab.mit.edu/SM-SMI-2005/).本届大会包括连续举行的两个享有盛誉的研讨会，即一年一度的实体和物理建模研讨会(6月13日至15日)和一年一度的造型国际会议(6月15日至17日)。这些会议中的第二个会议，IEEE形状建模和应用国际会议(SMI05)，网站http://www.shapemodeling.org/，是本提案的主题。它是由电气和电子工程师协会计算机学会(IEEE-CS)共同赞助的，并为向广泛领域的不同专家社区传播用于建模和处理形状及其属性的数字表示的新计算技术提供了一个论坛。在此之前，将举行由计算机械协会计算机图形学特别兴趣小组(ACM SIGGRAPH)共同赞助的ACM实体和物理建模研讨会(SPM‘05)，网站为http://www.solidmodeling.org/spm.html，。它是一个年度国际论坛，交流空间建模和计算在设计、分析和制造以及新兴生物医学、地球物理和其他领域的应用方面的最新研究。这两个会议在国际上享有盛誉，它们吸引了非常高质量的论文。

In June 2005, MIT is hosting and co-sponsoring the International Convention on Shapes and Solids (website: http://deslab.mit.edu/SM-SMI-2005/). This Convention comprises two prestigious symposia that are being held consecutively, namely, the annual Solid and Physical Modeling Symposium (June 13-15), and the annual Shape Modeling International Conference (June 15-17). The second of these conferences, the IEEE International Conference on Shape Modeling and Applications (SMI '05), website http://www.shapemodeling.org/, is the subject of this proposal. It is co-sponsored by the Institute of Electrical and Electronic Engineers Computer Society (IEEE-CS) and provides a forum for the dissemination of new computational techniques for modeling and processing digital representations of shapes and their properties to a diverse community of experts across a wide range of areas. It will be preceded by the ACM Symposium on Solid and Physical Modeling (SPM '05), website http://www.solidmodeling.org/spm.html, which is co-sponsored by the Association for Computing Machinery Special Interest Group on Computer Graphics (ACM SIGGRAPH). It is an annual international forum for the exchange of recent research in applications of spatial modeling and computations in design, analysis and manufacturing, as well as in emerging biomedical, geophysical and other areas. The two conferences have an excellent international reputation and they attract very high quality papers.