Support for Student Attendance at the ACM Symposium on Solid and Physical Modeling; June 13-15, 2005; Cambridge, MA

支持学生参加 ACM 实体和物理建模研讨会；

• 批准号: 0529916
• 负责人: Nicholas Patrikalakis
• 金额: --
• 依托单位: Massachusetts Institute of Technology
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-05-01 至 2005-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0529916&HistoricalAwards=false
• 关键词: Support; Student; Attendance; ACM; Symposium

PROPOSAL TO SUPPORT STUDENT ATTENDANCE AT THE ACM SYMPOSIUM ON SOLID AND PHYSICAL MODELINGAbstractIn June 2005, MIT is hosting and co-sponsoring the International Convention on Shapes and Solids (website: http://deslab.mit.edu/SM-SMI-2005/). This Convention comprises two prestigious symposia that are being held consecutively, namely, the annual Solid and Physical Modeling Symposium (June 13-15), and the annual Shape Modeling International Conference (June 15-17). The first of these conferences, the ACM Symposium on Solid and Physical Modeling (SPM '05), website http://www.solidmodeling.org/spm.html, is the subject of this proposal. It is co-sponsored by the Association for Computing Machinery Special Interest Group on Computer Graphics (ACM SIGGRAPH) and is an annual international forum for the exchange of recent research in applications of spatial modeling and computations in design, analysis and manufacturing, as well as in emerging biomedical, geophysical and other areas. The second conference, the IEEE International Conference on Shape Modeling and Applications (SMI '05), website http://www.shapemodeling.org/, is co-sponsored by the Institute of Electrical and Electronic Engineers Computer Society (IEEE-CS) and provides a forum for the dissemination of new computational techniques for modeling and processing digital representations of shapes and their properties to a diverse community of experts across a wide range of areas. The two conferences have an excellent international reputation and they attract very high quality papers.

2005年6月，麻省理工学院主办并共同发起了关于固体和固体的国际会议（网址：http：//deslab.mit.edu/SM-SMI-2005/）。该会议包括两个连续举行的著名研讨会，即年度实体和物理建模研讨会（6月13日至15日）和年度形状建模国际会议（6月15日至17日）。这些会议中的第一个，ACM实体和物理建模研讨会（SPM '05），网站http：//www.solidmodeling.org/spm.html，是本提案的主题。它是由计算机械协会计算机图形特别兴趣小组（ACM SIGGRAPH）共同赞助的，是一个年度国际论坛，用于交流空间建模和计算在设计，分析和制造以及新兴生物医学，地球物理和其他领域的应用方面的最新研究。第二次会议，IEEE形状建模和应用国际会议（SMI '05），网址http：//www.shapemodeling.org/，由电气和电子工程师学会计算机协会（IEEE-CS）共同赞助，并提供了一个论坛，用于向广泛领域的专家的不同社区传播用于建模和处理形状及其属性的数字表示的新计算技术。这两个会议在国际上享有很高的声誉，吸引了高质量的论文。