SBIR Phase I: Hermetic Micropackaging Applying Wafer-Level and Chip-Scale Integration

SBIR 第一阶段：采用晶圆级和芯片级集成的密封微封装

• 批准号: 0539470
• 负责人: Kaoru Maner
• 金额: --
• 依托单位: Omnipak, LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-01-01 至 2006-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0539470&HistoricalAwards=false
• 关键词: SBIR; Phase; Hermetic; Micropackaging; Applying

This Small Business Innovation Research Phase I project addresses packaging techniques for MEMS/NEMS components and systems. Applying wafer-level and chip-scale approaches new designs will allow for hermetic encapsulation of sensitive structures, as well as simple, multi-functional electrical, microfluidic, optical and thermal interconnection of system components. This project will demonstrate feasibility of a method to package electronic components in such a way that a) high frequency performance is optimized; b) cost is minimized; c) the integrity of the components are protected both during packaging and over life; d) application flexibility is maintained. The basic process steps will be demonstrated and prototypes developed for wafer-level chip-scale packaging for optical components using proprietary techniques for temporary wafer bonding of pre-thinned wafers; formation of through-substrate vias, along with insulation and metallization of the vias; and joining by solder or other methods. The proposed packaging techniques allow for a variety of devices to be placed in a miniature sealed cavity, having provision for maintenance of vacuum over life. Also in conjunction with inkjet printing methods, a single via design may be adapted to fluidics, optics or thermal dissipation.Wafer-level and chip-scale-packaging offers critical advantages of miniaturization, cost reduction, and performance and reliability enhancements. These are, in fact, the historical and future drivers for most of the semiconductor industry. In addition to mainstream semiconductor applications, the approach offers unique solutions for devices such as inertial grade navigation instruments, where performance and reliability enhancements may be of utmost importance.

这个小企业创新研究第一阶段项目解决MEMS/NEMS组件和系统的封装技术。应用晶圆级和芯片级方法的新设计将允许敏感结构的密封封装，以及系统组件的简单，多功能的电气，微流体，光学和热互连。该项目将证明一种方法的可行性，以这种方式封装电子元件，a）高频性能得到优化; B）成本最小化; c）在封装期间和整个寿命期间保护元件的完整性; d）保持应用灵活性。基本的工艺步骤将被证明和原型开发的晶圆级芯片级封装的光学元件使用专有技术的临时晶圆键合的预薄晶圆;形成贯穿基板的过孔，沿着与绝缘和金属化的过孔;并通过焊接或其他方法连接。所提出的封装技术允许将各种器件放置在微型密封腔中，并提供在寿命期间保持真空。此外，结合喷墨印刷方法，单通孔设计可适用于流体、光学或散热。晶圆级和芯片级封装提供了小型化、降低成本以及增强性能和可靠性的关键优势。事实上，这些是大多数半导体行业的历史和未来驱动力。除了主流半导体应用外，该方法还为惯性级导航仪器等器件提供了独特的解决方案，这些器件的性能和可靠性增强可能至关重要。