SBIR Phase I: Self Sensing Tweezers for Microassembly and Manipulation

这个小型企业创新研究(SBIR)第一阶段项目致力于用于微组装和操作的新型自感应式镊子。总体而言，推动小型化需要生产和组装各种各样的微型部件。关键挑战之一是将这些部件组装成微系统。这种新的方法在高长宽比的微尺度纤维中产生驻波，将克服与引力相关的问题，为试件的力反馈提供自我传感检测，并具有固有的尺寸测量能力。使用这种方法作为高深宽比镊子将：在精确放置的微型器件的组装中实现更高的成品率，能够在具有挑战性的特征(如空洞和洞)中组装和操纵样品，并在整个组装过程中实现现场工艺测量。这项研究在驻波机械手中的更广泛的影响是使新的微组装工艺成为可能，并为微和纳米尺度的科学提供对新的设计和发现的洞察力。医学领域包括显微外科、微生物学和医学植入等领域。更广泛的应用还包括集成电路组装、用于蛋白质和DNA识别的微流控设备，以及用于驱动和传感的MEMS设备。这种方法本质上可以扩展到微米级，并进一步扩展到纳米级应用程序。在微尺度加工的情况下，机械手工具可以导致更低的生产成本、更高的重复性和更高的尺寸精度。

This Small Business Innovation Research (SBIR) Phase I project addresses novel, self-sensing tweezers for micro-assembly and manipulation. In general, the push toward miniaturization is demanding the production and assembly of a wide variety of micro-scale components. One of the key challenges is the assembly of these components into micro-systems. The new methodology, which generates standing waves in high aspect ratio microscale fibers, will overcome problems associated with attraction forces, provide self sensing detection for force feedback of specimens and is inherently capable of dimensional measurements. Using this method as high aspect ratio tweezers will: enable higher yields in assembly of micro-devices with precise placement, ability to assemble and maneuver samples in challenging features such as cavities and holes, and enable in-situ process easurements throughout the assembly process.The broader impact of this research in standing wave manipulators is to enable new micro-assembly processes and provide insight into new designs and discoveries for micro and nano-scale science. The medical field includes areas such as microsurgery, microbiology, and medical implants. Broader applications also include integrated circuit assembly, microfluidic devices for protein and DNA identification, and MEMS devices for actuation and sensing. The methodology is inherently scaleable to microscale and further to nanoscale applications. In the case of microscale processes, the manipulator tool could result in lower production costs, higher repeatability, and higher dimensional accuracy.