STTR Phase I: Flexible Flip Chip Connection (F2C2) Technology

STTR 第一阶段：柔性倒装芯片连接 (F2C2) 技术

• 批准号: 0637978
• 负责人: Frank Andros
• 金额: --
• 依托单位: Binghamton Semiconductor Packaging, LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-01-01 至 2007-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0637978&HistoricalAwards=false
• 关键词: STTR; Phase; Flexible; Flip; Chip

The Small Business Technology Transfer Research (STTR) Phase I project will advance a modified electronic packaging technique by attaching a silicon chip to a chip carrier using an area array of flexible wires, named Flexible Flip Chip Connection (F2C2) technology. F2C2 uses flexible copper wires as a medium to connect the die to the chip carrier in lieu of solder balls used in current flip chip packaging . This research effort will focus on optimum design and development of F2C2 structure, materials, and process considering reilability, yield.cost and environment.The proposed technology will help eliminate the dependency on lead-based solders; and will solve the coefficient of thermal expansion mismatch problem in electronic packages, thereby improving the reliability of electronic components. This technology will also be potentially applicable to MEMS packaging and other small-scale packages.

小企业技术转移研究（STTR）第一阶段项目将推进一种改进的电子封装技术，通过使用一种名为柔性倒装芯片连接（F2C2）技术的柔性导线区域阵列将硅芯片连接到芯片载体上。 F2C2使用柔性铜线作为介质来将管芯连接到芯片载体，以代替当前倒装芯片封装中使用的焊球。 本研究将从可靠性、成品率、成本和环境等多方面考虑，对F2C2结构、材料和工艺进行优化设计和开发，以消除对铅基焊料的依赖，解决电子封装中的热膨胀系数失配问题，从而提高电子元器件的可靠性。 该技术也将潜在地应用于MEMS封装和其他小规模封装。