STTR Phase I: Flexible Flip Chip Connection (F2C2) Technology

小型企业技术转移研究(STTR)第一阶段项目将推进一种改进的电子封装技术，方法是使用柔性导线的面积阵列将硅芯片连接到芯片载体上，称为柔性倒装芯片连接(F2C2)技术。F2C2使用柔性铜线作为将芯片连接到芯片载体的媒介，而不是当前倒装芯片封装中使用的焊球。这项研究工作将集中在F2C2的结构、材料和工艺的优化设计和开发上，综合考虑可重复性、成品率、成本和环境，所提出的技术将有助于消除对铅基焊料的依赖，并将解决电子封装中的热膨胀系数不匹配问题，从而提高电子元器件的可靠性。这项技术也将潜在地应用于MEMS封装和其他小规模封装。

The Small Business Technology Transfer Research (STTR) Phase I project will advance a modified electronic packaging technique by attaching a silicon chip to a chip carrier using an area array of flexible wires, named Flexible Flip Chip Connection (F2C2) technology. F2C2 uses flexible copper wires as a medium to connect the die to the chip carrier in lieu of solder balls used in current flip chip packaging . This research effort will focus on optimum design and development of F2C2 structure, materials, and process considering reilability, yield.cost and environment.The proposed technology will help eliminate the dependency on lead-based solders; and will solve the coefficient of thermal expansion mismatch problem in electronic packages, thereby improving the reliability of electronic components. This technology will also be potentially applicable to MEMS packaging and other small-scale packages.