STTR Phase II: Improved Boron Nitride Materials for Enhanced Thermal Management

STTR 第二阶段：改进氮化硼材料以增强热管理

• 批准号: 0646556
• 负责人: John Ferguson
• 金额: $ 50万
• 依托单位: ALD NANOSOLUTIONS, INC.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-03-15 至 2009-02-28
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0646556&HistoricalAwards=false
• 关键词: STTR; Phase; II; Improved; Boron

This Small Business Technology Transfer (STTR) Phase II project builds upon the successful Phase I results to develop surface modified boron nitride (BN) filler materials for electronic thermal management applications. Novel Atomic Layer Deposition (ALD) nanocoating is used to selectively functionalize edges only or edges/basal planes to improve wetting of BN platelets with resin encapsulants. The improved wetting allows for reduced viscosity of BN/resin mixtures during processing so that increased BN filler particle loadings can be achieved, resulting in higher thermal conductivity electronic packages. These improvements are best realized using an ultra-thin (nm thick), conformal, pin-hole free, chemically bonded silica nanofilm selectively placed on the edges of primary BN platelets. Coating the edges of platelets only provides for a low cost impact since edges being nanocoated represent less than 10% of the available platelet surface area. Higher BN loadings in filled composites allow for improved heat dissipation in electronic packaging materials, particularly in the case of glob top coatings and potting compounds. Proposed Phase II R&D is focused on working with potential customers to develop applications of particle ALD surface modified BN fillers for their specific moulding compound systems. Film chemistry and thickness will be developed for their specific applications.Commercially, the ALD nanocoating of individual ultrafine particles to control their surfacechemistry is enabling technology that is unparalleled compared to more conventional CVD,PVD, PE-CVD, or wet chemistry solution processing. The process allows for individualultra-fine particles to be nanocoated, rather than coating aggregates of ultra-fine particles. Itis independent of line of sight and provides for chemically bonded films to the substrateparticle surface. It is easily scalable. It is a forgiving process where the nanocoatingthickness is controlled by self-limiting surface reactions (not flux, temperature, or time ofprocessing like CVD, etc.). ALD films are pin-hole free and conformal. The potentialimpact of successful large scale processing extends far beyond this proposedmicroelectronics packaging application. It is now possible to produceultrafine particles with designed electrical, magnetic, optical, mechanical, rheological, orother properties. Markets for such functionalized ultra-fine powders includemicroelectronics, defense, hardmetals, cosmetics, drug delivery, energetic materials, andpolymer/ceramic nanocomposites, among others.

这个小企业技术转让（STTR）第二阶段项目建立在成功的第一阶段结果的基础上，开发用于电子热管理应用的表面改性氮化硼（BN）填料材料。新型原子层沉积（ALD）纳米涂层用于选择性地仅功能化边缘或边缘/基面以改善BN片晶与树脂澄清剂的润湿。改善的润湿允许在加工期间降低BN/树脂混合物的粘度，使得可以实现增加的BN填料颗粒负载，导致更高的热导率电子封装。这些改进最好使用选择性地放置在初级BN片晶边缘上的超薄（nm厚）、保形、无针孔、化学键合的二氧化硅纳米膜来实现。涂覆血小板的边缘仅提供低成本影响，因为被纳米涂覆的边缘代表小于可用血小板表面积的10%。填充复合材料中较高的BN负载允许改善电子封装材料中的散热，特别是在团状顶部涂层和灌封化合物的情况下。拟议的第二阶段研发重点是与潜在客户合作，开发颗粒ALD表面改性BN填料在其特定模塑料系统中的应用。薄膜化学和厚度将针对其特定应用进行开发。在商业上，单个超细颗粒的ALD纳米涂层可以控制其表面化学性质，与更传统的CVD，PVD，PE-CVD或湿化学溶液处理相比，该技术是无与伦比的。该方法允许单个超细颗粒被纳米包覆，而不是包覆超细颗粒的聚集体。它不依赖于视线，并提供化学键合膜到衬底颗粒表面。它很容易扩展。这是一个宽容的过程，其中纳米涂层厚度是由自限制表面反应（而不是流量，温度或时间的处理，如CVD等）控制。ALD膜是无针孔且保形的。成功的大规模加工的潜在影响远远超出了这个拟议的微电子封装应用。现在可以生产具有设计好的电、磁、光、机械、流变或其他性质的超细颗粒。这种功能化超细粉体的市场包括微电子、国防、硬质合金、化妆品、药物输送、高能材料和聚合物/陶瓷纳米复合材料等。