STTR Phase I: Improved Boron Nitride Materials for Enhanced Thermal Management

STTR 第一阶段：改进氮化硼材料以增强热管理

• 批准号: 0512932
• 负责人: John Ferguson
• 金额: $ 10万
• 依托单位: ALD NANOSOLUTIONS, INC.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-07-01 至 2006-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0512932&HistoricalAwards=false
• 关键词: STTR; Phase; Improved; Boron; Nitride

This Small Business Technology Transfer Phase I project provides for the manufactureof improved boron nitride (BN) filler materials for electronic thermal management applications.Novel Atomic Layer Deposition (ALD) nanocoating is used to selectively functionalize edges only or edges/basal planes to improve wetting of BN platelets with resin encapsulants. The improved wetting allows for significantly reduced viscosity (~ 5 times less) of BN/resin mixtures during processing and improved interfacial adhesion in the cured composite. These improvements are realized using an ultra-thin (nm thick), conformal, pin-hole free, chemically bonded alumina nanofilm on individual BN platelets that provides for an improvement in rheological properties without a significant reduction in thermal conductivity. Hence, higher BN loadings in filled composites will allow for significantly improved heat dissipation in electronic packaging materials, particularly in the case of glob top coatings and potting compounds. Individual fine sized BN platelet particles will be selectively nanocoated (edges only or edges/basal planes) with chemically bonded Al2O3 films of ~50, 25, 12.5, 6.3, 3.2, 1.6, and 0.8 nanometer thickness. The nanocoated BN will be blended at a 40 volume % loading in a liquid encapsulant mixture (will measure viscosity), cured, and tested for thermal conductivity and peel strength.Commercially this addresses one of the most pressing problems in the electronics industry, namely the heat dissipation required by the use of faster and more powerful chips. Since boron nitride has one of the best thermal conductivities as a filler, any improvement in its performance can positively address this problem. Furthermore the potential impact of successful large scale processing extends far beyond this proposed microelectronics packaging application. Nanoscience will only achieve true "disruptive" technology status if the individual surfaces of ultrafine particles can be functionalized. ALD nanocoating of ultrafine particles provides such an opportunity. It is now possible to produce ultrafine particles with designed electrical, magnetic, optical, mechanical, rheological, or other properties. Markets for such functionalized ultra-fine powders include microelectronics, defense, hard metals, cosmetics, drug delivery, energetic materials, and polymer/ceramic nanocomposites, among others. A better understanding of the nanocoating of ultra-fine particles and its cost/performance value will be developed.

这个小型企业技术转移一期项目提供了用于电子热管理应用的改进氮化硼（BN）填充材料的制造。新型原子层沉积（ALD）纳米涂层用于选择性地功能化边缘或边缘/基面，以改善树脂包封剂对BN片的润湿。改进的润湿性允许在加工过程中显著降低BN/树脂混合物的粘度（约低5倍），并改善固化复合材料的界面附着力。这些改进是通过在单个BN薄片上使用超薄（nm厚）、保形、无针孔、化学键合的氧化铝纳米膜来实现的，这可以改善流变性能，而不会显著降低导热性。因此，在填充复合材料中更高的BN负载将允许显着改善电子封装材料的散热，特别是在球形顶部涂层和灌封化合物的情况下。单个细尺寸的BN血小板颗粒将被选择性地纳米涂覆（仅边缘或边缘/基面），化学结合的Al2O3膜厚度为~50、25、12.5、6.3、3.2、1.6和0.8纳米。纳米涂层的BN将以40体积%的负载混合在液体封装剂混合物中（将测量粘度），固化，并测试导热性和剥离强度。从商业上讲，这解决了电子工业中最紧迫的问题之一，即使用更快、更强大的芯片所需的散热问题。由于氮化硼作为填料具有最好的导热性之一，因此其性能的任何改进都可以积极地解决这个问题。此外，成功的大规模加工的潜在影响远远超出了这个提议的微电子封装应用。如果超细颗粒的单个表面能够功能化，纳米科学将实现真正的“颠覆性”技术地位。ALD纳米涂层的超细颗粒提供了这样的机会。现在有可能生产出具有设计好的电学、磁学、光学、机械、流变学或其他特性的超细颗粒。这种功能化超细粉末的市场包括微电子、国防、硬金属、化妆品、药物输送、高能材料和聚合物/陶瓷纳米复合材料等。我们将进一步了解超细颗粒纳米涂层及其性价比。