STTR Phase II: Fully Embedded Optical Interconnects based on Optical Bus Architecture for Large Size Printed Circuit Boards

STTR第二阶段：基于大尺寸印刷电路板光总线架构的全嵌入式光互连

• 批准号: 0724096
• 负责人: Alan Wang
• 金额: --
• 依托单位: Omega Optics, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-09-01 至 2010-02-28
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0724096&HistoricalAwards=false
• 关键词: STTR; Phase; II; Fully; Embedded

This STTR Phase II research project is to develop a commercial board level optical interconnect using bus architecture. Conventional copper links on printed circuit boards fail to provide sufficient bandwidth for data transfer above 10 Gbit/sec. Optical interconnections are widely viewed as an alternative to higher throughput. However, existing photonics-related approaches suffer from issues of packaging, reliability and manufacturing cost. In this project, Omega Optics and the University of Texas at Austin seek to develop a fully embedded board level optical interconnect for enhanced bandwidth, while reducing the difficulties of optoelectronic packaging and device reliability. Phase I results demonstrated 150 GHz bandwidth with 51 cm interconnection distance. Instead of utilizing surface mounted optical components this approach separates the fabrication of the optical layer with the electrical parts and laminates it inside printed circuit boards, between which the interconnection is setup through in-layer vias. This fully embedded technology seals all the optical components and provides a seamless interface with electrical layers, therefore it eliminates the concerns of external optoelectronic devices for end users. The revolutionary breakthrough over copper links sought through this research would benefit the entire computer industry and enable the continued progression of bandwidth and interconnect distance.

本STTR第二阶段研究计划是开发一个商用的板级光互连总线架构。印刷电路板上的传统铜链路无法为10 Gbit/秒以上的数据传输提供足够的带宽。光学互连被广泛视为更高吞吐量的替代方案。然而，现有的光子学相关方法受到封装、可靠性和制造成本的问题的困扰。在该项目中，Omega Optics和德克萨斯大学奥斯汀分校寻求开发一种完全嵌入式板级光学互连，以增强带宽，同时降低光电封装和器件可靠性的难度。第一阶段的结果表明，150 GHz的带宽与51厘米的互连距离。代替利用表面安装的光学部件，该方法将光学层的制造与电气部件分离，并将其层压在印刷电路板内，在印刷电路板之间通过层内通孔设置互连。这种完全嵌入式技术密封了所有光学元件，并提供了与电气层的无缝接口，因此消除了最终用户对外部光电设备的担忧。 通过这项研究寻求的铜线链路的革命性突破将使整个计算机行业受益，并使带宽和互连距离继续发展。