BRIGE: Surface-Normal Plasmonic Modulator for Three-Dimensional Board-to-Board and Chip-to-Chip Optical Interconnects

BRIGE：用于三维板对板和芯片对芯片光学互连的表面法线等离子体调制器

• 批准号: 1342318
• 负责人: Alan Wang
• 金额: $ 17.46万
• 依托单位: Oregon State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-09-15 至 2016-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1342318&HistoricalAwards=false
• 关键词: BRIGE; Surface; Normal; Plasmonic; Modulator

ECCS - 1342318 Wang, Alan X. Oregon State UniversityBRIGE: Surface-Normal Plasmonic Modulator for Three-Dimensional Board-to-Board and Chip-to-Chip Optical Interconnects ABSTRACTIntellectual Merit: The objective of this BRIGE proposal is to investigate a surface-normal plasmonic modulator structure with ultra-high energy efficiency and modulation bandwidth for three-dimensional optical interconnects based on sub-wavelength metallic photonic crystals. In recent years, the demand of ultrahigh-speed optical modulation above 100G bit/sec is becoming increasingly imperative as the bottleneck of electric interconnects has significantly constrained the performance of communication and computer systems. Today's research in optical interconnects focuses on planar-lightwave-circuit devices integrated with printed circuit boards and microprocessor chips, which is difficult to provide three-dimensional optical links. This BRIGE proposal explores a surface-normal plasmonic modulator with 10 femto-joule/bit energy efficiency and 100G bit/sec modulation speed for three-dimensional board-to-board and chip-to-chip optical interconnects. Compared with existing surface plasmon waveguide photonic devices that have high metallic absorption, the proposed surface-normal architecture efficiently reduces the total optical loss below 3-dB with stable and convenient couplings to single-mode fibers and surface-emitting laser diodes. Elucidative exploration and proof-of-concept demonstration of such innovative plasmonic modulators will lay a solid foundation for further system integration with electronic circuit and communication systems. Broader Impacts: The proposed research promises to impact academia, industry, and society at large by providing an innovative surface-normal plasmonic modulator structure for out-of-plane optical interconnects. If successful, it can accelerate the frontline research of both plasmonic photonic devices and optical interconnects. This unique plasmonic device promises to transcend existing high-speed electro-optic modulation technologies for optical communication, signal processing, optical sensing and nonlinear optics. The synergy of this research and education will benefit graduate, undergraduate and K-12 students, and broaden the participation of women and under-represented minorities at Oregon State University through the programs of Summer Experience in Science and Engineering for Youth. This research also aims at promoting broad participation of under-represented students in industrial partnerships through short-term visits, summer internships, and research collaboration with local companies such as Hewlett-Packard and Voxtel. Exposure of students with a diverse background to cutting edge research will enrich their research experiences, cultivate their creativity, and train their hands-on skills, which will contribute to strengthening the quality of the U.S. workforce in the future.

CCS-1342318 Wang，Alan X.俄勒冈州立大学BRIGE：用于三维板到板和芯片到芯片光学互连的表面正态等离子体调制器智能优点：该布里奇方案的目标是研究一种基于亚波长金属光子晶体的三维光学互连具有超高能量效率和调制带宽的表面正态等离子体调制器结构。近年来，由于电互连的瓶颈已经严重制约了通信和计算机系统的性能，对100G比特/秒以上的超高速光调制的需求日益迫切。目前对光互连的研究主要集中在平面光波电路器件上，这种器件与印刷电路板和微处理器芯片集成在一起，很难提供三维光链路。这项布里奇方案探索了一种用于三维板到板和芯片到芯片光学互连的能量效率为10FJ/比特、调制速度为100G比特/秒的表面正态等离子体调制器。与现有的具有高金属吸收的表面等离子体波导光器件相比，所提出的表面法线结构通过稳定和方便地耦合到单模光纤和表面发射激光二极管，有效地将总光学损耗降低到3db以下。这种创新的等离子体调制器的说明性探索和概念验证演示将为进一步将系统与电子电路和通信系统集成奠定坚实的基础。更广泛的影响：拟议的研究有望通过为平面外光学互连提供创新的表面法向等离子体调制器结构来影响学术界、工业界和整个社会。如果成功，它将加速等离子体光子器件和光学互连的一线研究。这种独特的等离子体器件有望超越现有的高速电光调制技术，用于光通信、信号处理、光学传感和非线性光学。这项研究和教育的协同作用将使研究生、本科生和K-12年级的学生受益，并通过青年科学和工程暑期体验项目扩大俄勒冈州立大学女性和未被充分代表的少数族裔的参与。这项研究还旨在通过短期访问、暑期实习以及与当地公司(如惠普和Voxtel)的研究合作，促进代表不足的学生广泛参与产业伙伴关系。让具有不同背景的学生接触尖端研究将丰富他们的研究经验，培养他们的创造力，并训练他们的动手技能，这将有助于加强未来美国劳动力的素质。