SBIR Phase II: Fabrication of Conformal Antennas for Airborne SatCom Using Kinetic Metallization

SBIR 第二阶段：使用动能金属化制造机载卫星通信共形天线

• 批准号: 0724502
• 负责人: Ralph Tapphorn
• 金额: $ 50万
• 依托单位: INNOVATIVE TECHNOLOGY, INC.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-09-01 至 2011-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0724502&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Fabrication; Conformal

This Phase II SBIR research project will develop direct write copper conductors onto doubly curved dielectric substrates using the Kinetic Metallization (KM) process. There is a need for new processes and methodologies to enable low profile RF systems on current and planned airborne platforms. Low profiles antennas are achieved through integration with structural elements. The concept is referred to as aperstructures, and in this Phase II research the scientific and engineering foundation necessary for robust aperstructures will be laid. Principally, research to establish process-property relationships will be conducted, as well as an investigation of novel material systems. The envisioned result of this research is conformal antennas integrated into the load bearing structures of the application platform. Conformal antennas represent a significant stride forward in the ability to communicate in high bandwidth applications. They also offer lower profiles, lighter weight and greater mission flexibility. Originally airborne platforms were identified as high benefit early adopters. Targeted markets in the Navy and Air Force have already been identified with customers awaiting the Phase II results to transition the KM process to the manufacture of antennas. Ship systems, land systems, and non-military opportunities such as automobiles and skyscrapers will also gain from the development of this research.

SBIR第二阶段的研究项目将采用动力学金属化（KM）工艺在双曲面电介质基板上开发直写铜导体。需要新的过程和方法来在当前和计划的机载平台上实现低轮廓RF系统。低剖面天线通过与结构元件集成来实现。这个概念被称为aperstructures，在第二阶段的研究中，将奠定坚实的aperstructures所需的科学和工程基础。主要是研究建立工艺-性能关系，以及对新材料系统的调查。本研究的预期结果是共形天线集成到应用平台的承载结构中。共形天线代表了在高带宽应用中通信能力的重大进步。它们还提供更低的外形、更轻的重量和更大的使命灵活性。最初，机载平台被认为是高效益的早期采用者。海军和空军的目标市场已经确定，客户正在等待第二阶段的结果，以便将KM过程过渡到天线制造。船舶系统、陆地系统以及汽车和摩天大楼等非军事机会也将从这项研究的发展中获益。