SBIR Phase II: Fabrication of Conformal Antennas for Airborne SatCom Using Kinetic Metallization

SBIR 第二阶段：使用动能金属化制造机载卫星通信共形天线

• 批准号: 0724502
• 负责人: Ralph Tapphorn
• 金额: $ 50万
• 依托单位: INNOVATIVE TECHNOLOGY, INC.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-09-01 至 2011-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0724502&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Fabrication; Conformal

This Phase II SBIR research project will develop direct write copper conductors onto doubly curved dielectric substrates using the Kinetic Metallization (KM) process. There is a need for new processes and methodologies to enable low profile RF systems on current and planned airborne platforms. Low profiles antennas are achieved through integration with structural elements. The concept is referred to as aperstructures, and in this Phase II research the scientific and engineering foundation necessary for robust aperstructures will be laid. Principally, research to establish process-property relationships will be conducted, as well as an investigation of novel material systems. The envisioned result of this research is conformal antennas integrated into the load bearing structures of the application platform. Conformal antennas represent a significant stride forward in the ability to communicate in high bandwidth applications. They also offer lower profiles, lighter weight and greater mission flexibility. Originally airborne platforms were identified as high benefit early adopters. Targeted markets in the Navy and Air Force have already been identified with customers awaiting the Phase II results to transition the KM process to the manufacture of antennas. Ship systems, land systems, and non-military opportunities such as automobiles and skyscrapers will also gain from the development of this research.

该二期SBIR研究项目将利用动力学金属化（KM）工艺开发双弯曲介质衬底上的直接写铜导体。需要新的工艺和方法来实现当前和计划中的机载平台上的低姿态射频系统。低轮廓天线通过与结构元件的集成来实现。这个概念被称为基础结构，在这个第二阶段的研究中，将为坚固的基础结构奠定必要的科学和工程基础。主要是研究建立工艺-性能关系，以及对新型材料系统的调查。本研究的预期结果是将共形天线集成到应用平台的承载结构中。共形天线代表了在高带宽应用中通信能力的重大进步。它们还具有更低的外形、更轻的重量和更大的任务灵活性。最初，机载平台被认为是高效益的早期采用者。海军和空军的目标市场已经确定，客户正在等待第二阶段的结果，以将KM过程过渡到天线的制造。船舶系统、陆地系统和非军事机会，如汽车和摩天大楼，也将从这项研究的发展中获益。