Collaborative Research: Investigation of Local Flow Boiling Heat Transfer on Micro-Pin-Fins Using Thin-Film Temperature/Heat Flux Sensor Arrays

合作研究：使用薄膜温度/热通量传感器阵列研究微针翅片上的局部流动沸腾传热

• 批准号: 0730315
• 负责人: Weilin Qu
• 金额: $ 17.19万
• 依托单位: University of Hawaii
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-07-01 至 2011-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0730315&HistoricalAwards=false
• 关键词: Collaborative; Research; Investigation; Local; Flow

Collaborative Research: Investigation of Local Flow Boiling Heat Transfer on Micro-Pin-Fins Using Thin-Film Temperature/Heat Flux Sensor ArraysThe objective of this research is to study the local heat transfer variations on micro-scale pin-fins in order to better understand the fundamental behavior of liquid flow boiling in miniature heat sinks. An improved understanding of these localized phenomena is crucial for developing heat-sinks for next generation high-performance electronics. The research approach involves the design, fabrication, characterization, and use of an array of unique thin-film temperature and heat flux sensors (50 x 50 micron in size) directly on the side of a copper micro-fin. The instrumented fin will be mounted in a specially designed miniature heat sinks to observe the gas-liquid two-phase flow pattern, flow instability, pressure loss, and heat transfer associated with liquid flow boiling in both staggered and aligned micro-pin-fin arrays. High-speed video imaging will be used to capture local and global flow patterns. The local (single pin) and global heat transfer and flow pattern, and global pressure drop data will be used to create empirical correlations and flow pattern-based models to predict the liquid flow boiling heat transfer in micro-pin-fin arrays. This work will benefit society by generating the knowledge needed to design and safely operate two-phase (boiling) miniature heat sinks that can remove larger amounts of heat from smaller areas more economically. This is necessary if the current pursuit of circuit integration and device miniaturization in electronics industry is to be continued in the future. Also, the micro-scale integrated temperature and heat flux sensors will significantly advance experimental techniques in basic heat transfer research. Further societal impact will result from training engineering students, recruiting and retaining students from underrepresented groups, and guiding them to graduate programs. Public outreach presentations will be developed to foster an interest in science and engineering among middle and high school students. The close collaboration between the universities will enhance knowledge transfer and expose the students to a more diverse educational experience.

合作研究：用薄膜温度/热流传感器阵列研究微针翅片上的局部流动沸腾换热本研究的目的是研究微尺度针片上的局部换热变化，以便更好地了解微型散热器中液体流动沸腾的基本行为。更好地理解这些局部化现象对于开发下一代高性能电子产品的散热器至关重要。研究方法包括设计、制造、表征和使用一组独特的薄膜温度和热流传感器阵列(尺寸为50x50微米)，直接安装在铜微翅片的一侧。仪表式翅片将安装在专门设计的微型散热器中，以观察交错和排列的微型针翅片阵列中与液体流动沸腾相关的气液两相流动模式、流动不稳定性、压力损失和传热。将使用高速视频成像来捕捉局部和全球流动模式。利用局部(单针)和整体换热与流型，以及整体压降数据，建立经验关联式和基于流型的模型，以预测微针-翅片阵列内的液体流动沸腾换热。这项工作将产生设计和安全运行两相(沸腾)微型散热器所需的知识，从而造福社会，这些散热器可以更经济地从较小的区域转移大量热量。如果电子工业目前对电路集成化和器件小型化的追求在未来继续下去，这是必要的。此外，微尺度集成温度和热通量传感器将显著促进基础传热学研究中的实验技术。培养工科学生，招收和留住代表不足的群体的学生，并指导他们攻读研究生课程，将产生进一步的社会影响。将开发公共宣传演示，以培养初中生对科学和工程的兴趣。大学之间的密切合作将加强知识转移，并使学生获得更多样化的教育体验。