Collaborative Research: Investigation of Local Flow Boiling Heat Transfer on Micro-Pin-Fins Using Thin-Film Temperature/Heat Flux Sensor Arrays

基于薄膜温度/热流传感器阵列的微针状翅片局部流动沸腾传热研究本研究的目的是研究微尺度针状翅片局部流动沸腾传热的变化，以便更好地了解微型散热器中液体流动沸腾的基本行为。提高对这些局部现象的理解对于开发下一代高性能电子散热片至关重要。研究方法包括设计、制造、表征和使用一组独特的薄膜温度和热流传感器（尺寸为50 x 50微米），直接放在铜微鳍的侧面。仪器鳍将安装在一个专门设计的微型散热器中，以观察交错和排列的微型鳍阵列中气液两相流动模式、流动不稳定性、压力损失和与液体流动沸腾相关的传热。高速视频成像将用于捕捉当地和全球的流量模式。利用局部（单针脚）和全局换热流型以及全局压降数据建立经验关联和基于流型的模型，预测微针脚鳍阵列中液体流动沸腾换热。这项工作将产生设计和安全操作两相（沸腾）微型散热器所需的知识，从而使社会受益，这种散热器可以更经济地从更小的区域去除大量的热量。如果电子工业要在未来继续追求电路集成化和器件小型化，这是必要的。此外，微尺度集成温度和热流密度传感器将大大推进基础传热研究的实验技术。进一步的社会影响将来自培训工程专业的学生，从代表性不足的群体中招募和留住学生，并指导他们攻读研究生课程。为了培养初高中学生对科学和工程的兴趣，将开展公众宣传演讲。两所大学之间的紧密合作将促进知识转移，并使学生获得更多元化的教育体验。

Collaborative Research: Investigation of Local Flow Boiling Heat Transfer on Micro-Pin-Fins Using Thin-Film Temperature/Heat Flux Sensor ArraysThe objective of this research is to study the local heat transfer variations on micro-scale pin-fins in order to better understand the fundamental behavior of liquid flow boiling in miniature heat sinks. An improved understanding of these localized phenomena is crucial for developing heat-sinks for next generation high-performance electronics. The research approach involves the design, fabrication, characterization, and use of an array of unique thin-film temperature and heat flux sensors (50 x 50 micron in size) directly on the side of a copper micro-fin. The instrumented fin will be mounted in a specially designed miniature heat sinks to observe the gas-liquid two-phase flow pattern, flow instability, pressure loss, and heat transfer associated with liquid flow boiling in both staggered and aligned micro-pin-fin arrays. High-speed video imaging will be used to capture local and global flow patterns. The local (single pin) and global heat transfer and flow pattern, and global pressure drop data will be used to create empirical correlations and flow pattern-based models to predict the liquid flow boiling heat transfer in micro-pin-fin arrays. This work will benefit society by generating the knowledge needed to design and safely operate two-phase (boiling) miniature heat sinks that can remove larger amounts of heat from smaller areas more economically. This is necessary if the current pursuit of circuit integration and device miniaturization in electronics industry is to be continued in the future. Also, the micro-scale integrated temperature and heat flux sensors will significantly advance experimental techniques in basic heat transfer research. Further societal impact will result from training engineering students, recruiting and retaining students from underrepresented groups, and guiding them to graduate programs. Public outreach presentations will be developed to foster an interest in science and engineering among middle and high school students. The close collaboration between the universities will enhance knowledge transfer and expose the students to a more diverse educational experience.