Collaborative Research: Investigation of Local Flow Boiling Heat Transfer on Micro-Pin-Fins Using Thin-Film Temperature/Heat Flux Sensor Arrays

合作研究：基于薄膜温度/热流传感器阵列的微针翅局部流动沸腾换热研究本研究的目的是研究微针翅上局部换热的变化规律，以便更好地理解微型热沉中液体流动沸腾的基本行为。 更好地理解这些局部化现象对于开发下一代高性能电子设备的散热器至关重要。 该研究方法涉及设计，制造，表征和使用一系列独特的薄膜温度和热流传感器（尺寸为50 x 50微米），直接位于铜微鳍的一侧。仪表翅片将被安装在一个专门设计的微型散热器观察气液两相流的流型，流动不稳定性，压力损失，并与液体流动沸腾在两个交错和对齐的微针翅阵列传热。 高速视频成像将被用来捕捉本地和全球的流动模式。 局部（单针）和全球的传热和流动模式，和全球的压降数据将被用来创建经验关联式和基于流动模式的模型，以预测液体流动沸腾传热在微针翅阵列。 这项工作将通过产生设计和安全操作两相（沸腾）微型散热器所需的知识来造福社会，这种散热器可以更经济地从较小的区域中去除大量的热量。 这是必要的，如果目前的追求电路集成化和设备小型化的电子工业是在未来继续。 此外，微尺度集成温度和热流传感器将显着推进实验技术在基础传热研究。 进一步的社会影响将来自于培养工程专业的学生，从代表性不足的群体中招募和留住学生，并指导他们攻读研究生课程。 将开发公共外联演示文稿，以培养初中和高中学生对科学和工程的兴趣。 大学之间的密切合作将促进知识转移，并使学生获得更多样化的教育体验。

Collaborative Research: Investigation of Local Flow Boiling Heat Transfer on Micro-Pin-Fins Using Thin-Film Temperature/Heat Flux Sensor ArraysThe objective of this research is to study the local heat transfer variations on micro-scale pin-fins in order to better understand the fundamental behavior of liquid flow boiling in miniature heat sinks. An improved understanding of these localized phenomena is crucial for developing heat-sinks for next generation high-performance electronics. The research approach involves the design, fabrication, characterization, and use of an array of unique thin-film temperature and heat flux sensors (50 x 50 micron in size) directly on the side of a copper micro-fin. The instrumented fin will be mounted in a specially designed miniature heat sinks to observe the gas-liquid two-phase flow pattern, flow instability, pressure loss, and heat transfer associated with liquid flow boiling in both staggered and aligned micro-pin-fin arrays. High-speed video imaging will be used to capture local and global flow patterns. The local (single pin) and global heat transfer and flow pattern, and global pressure drop data will be used to create empirical correlations and flow pattern-based models to predict the liquid flow boiling heat transfer in micro-pin-fin arrays. This work will benefit society by generating the knowledge needed to design and safely operate two-phase (boiling) miniature heat sinks that can remove larger amounts of heat from smaller areas more economically. This is necessary if the current pursuit of circuit integration and device miniaturization in electronics industry is to be continued in the future. Also, the micro-scale integrated temperature and heat flux sensors will significantly advance experimental techniques in basic heat transfer research. Further societal impact will result from training engineering students, recruiting and retaining students from underrepresented groups, and guiding them to graduate programs. Public outreach presentations will be developed to foster an interest in science and engineering among middle and high school students. The close collaboration between the universities will enhance knowledge transfer and expose the students to a more diverse educational experience.