Student Travel to the World Forum on Smart Materials and Smart Structures Technologies 2007; China

学生前往 2007 年智能材料和智能结构技术世界论坛；

• 批准号: 0737775
• 负责人: Masayoshi Tomizuka
• 金额: $ 1万
• 依托单位: University of California-Berkeley
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-06-15 至 2008-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0737775&HistoricalAwards=false
• 关键词: Student; Travel; World; Forum; Smart

TECHNICAL: The World Forum on Smart Materials and Smart Structures Technology (SMSST'07) will be held in Chongqing and Nanjing, China from May 22-27, 2007. Chongqing University (CQU), Nanjing University of Aeronautics and Astronautics (NUAA), and Hong Kong Polytechnic University will jointly host the forum. The objectives of SMSST'07 are: (a) to update the state-of-the-art with new knowledge gains, (b) to analyze technological innovations and achievements, (c) to assess the potential impact for transforming Engineering Practices, (d) to promote international engagement through cooperative platforms (US-Europe, US-China, US-Japan), (e) to form partnerships with industry, and (f) to broaden the outlook for revolutionizing student and education programs. It is also intended to involve young U.S. scientists to expose them to different social, technical, and cultural perspectives in China through active participation in this world forum. SMSST'07 is a major worldwide event that will highlight the major advancements in smart materials and their applications to sensors and smart structures. It will also allow the world's top experts to map out future challenges in research and innovation, as well as analyze, critique, and finalize the reports submitted by the US-Europe, US-China, and US-Japan joint task groups. This student travel request asks for a fund to provide partial support to let six graduate students travel to China and attend SMSST'07. The intellectual merit of this project is embedded in providing a premier opportunity for scientific, professional, and industrial colleagues worldwide to share ideas on the most recent and advanced developments, identify common research problems, and promote international cooperative research in the emerging technologies of smart materials and structures. The collaborative research activities are expected to develop smart materials and smart structures, innovative utilization of sensor systems and mechatronics approaches in smart structural systems, reduction of disaster risks through the utilization of smart devices and systems, and effective prognostic and diagnostic evaluation of mechanical and civil systems by smart materials and smart structures. NON-TECHNICAL: SMSST'07 is designed to have a broad impact in the areas of integrated sensor systems, mechatronics, and smart materials and smart structure technologies for aerospace, civil and mechanical systems through international collaborations both in terms of research and education. The workshop will invite, and make every effort to include, the participation of young and underrepresented groups of researchers to enhance the diversity of representation and their involvement in scientific activities. SMSST'07 will also promote the international collaboration to leverage resources, and share technical data and research ideas for the mutual benefit of the United States and European and Asian countries. Students participating in SMSST'07 are likely to be future leaders in the area of smart materials and smart structure technologies. They will have an opportunity to meet and be exposed to world leaders in the area as well as to experience different social, technical, and cultural perspectives in China through active participation in this world forum.

技术支持：2007年5月22日至27日，智能材料与智能结构技术世界论坛（SMSST'07）将在中国重庆和南京举行。重庆大学、南京航空航天大学和香港理工大学将联合主办此次论坛。SMSST'07的目标是：（a）以新的知识成果更新最新技术水平，（B）分析技术创新和成就，（c）评估工程实践变革的潜在影响，（d）通过合作平台促进国际参与（美国-欧洲、美国-中国、美国-日本），（e）与工业界建立伙伴关系，以及（f）拓宽改革学生和教育计划的前景。它还旨在通过积极参与这一世界论坛，让美国年轻科学家接触中国不同的社会、技术和文化视角。SMSST'07是一个重要的全球性活动，将突出智能材料及其在传感器和智能结构中的应用的重大进展。它还将使世界顶级专家能够规划研究和创新的未来挑战，并分析，评论和最终确定由美欧，中美和美日联合工作组提交的报告。这份学生旅行申请要求提供一笔资金，以提供部分支持，让六名研究生前往中国参加SMSST'07。该项目的智力价值在于为世界各地的科学，专业和工业同事提供了一个绝佳的机会，以分享最新和最先进的发展理念，确定共同的研究问题，并促进智能材料和结构新兴技术的国际合作研究。预计合作研究活动将开发智能材料和智能结构，智能结构系统中传感器系统和机电一体化方法的创新利用，通过智能设备和系统的利用减少灾害风险，以及智能材料和智能结构对机械和民用系统的有效预测和诊断评估。非技术性：SMSST'07旨在通过研究和教育方面的国际合作，在集成传感器系统，机电一体化，智能材料和智能结构技术领域产生广泛的影响。研讨会将邀请并尽一切努力让年轻和代表性不足的研究人员群体参与，以增强代表性的多样性及其对科学活动的参与。SMSST'07还将促进国际合作，以利用资源，分享技术数据和研究思路，为美国和欧洲和亚洲国家的共同利益。参加SMSST'07的学生很可能成为智能材料和智能结构技术领域的未来领导者。他们将有机会与该地区的世界领导人会面并接触，并通过积极参与这个世界论坛来体验中国不同的社会，技术和文化观点。