SBIR Phase II: High Performance Cooling Devices through Wafer Scale Manufacturing

SBIR 第二阶段：通过晶圆级制造实现高性能冷却设备

• 批准号: 0750189
• 负责人: Andrew Miner
• 金额: --
• 依托单位: Romny Scientific, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-02-01 至 2010-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0750189&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Performance; Cooling

This Small Business Innovation Research Phase II project will create high performance coolers using waferscale semiconductor manufacturing by building on the material processing foundations demonstrated in Phase I. Phase I work has demonstrated that high quality materials can be formed in a method that can be extended to high volume production. This Phase II effort will implement this manufacturing technique at a wafer scale, integrating Phase I materials into initial devices for customer evaluation and sale.The broader impacts of widespread deployment of efficient thermoelectric coolers include reduction in energy consumption and more efficient use of available energy by widespread use of high performance thermoelectric power generation from waste heat; and broad improvements in general quality of life by high performance compact coolers that allow continued advancement of products in the microelectronics and optoelectronics industries.

这个小型企业创新研究阶段II阶段项目将使用Waferscale半导体制造来创建高性能冷却器，通过在第一阶段I的材料加工基础上构建基础。第一阶段的工作表明，可以以一种可以扩展到大量生产的方法中形成高质量的材料。 这二阶段的努力将以晶圆的规模实施这种制造技术，将I期材料集成到初始设备中，以进行客户评估和销售。有效的热电冷却器的广泛部署的广泛部署包括降低能源消耗和更有效地利用可用的能源，从而广泛利用高性能的热能发电，从废物热量中产生高度的热电发电；高性能紧凑型冷却器在一般生活质量方面的广泛改进，这些冷却器允许在微电子和光电业行业中继续发展产品。