Simulation, Design and Fabrication of Interconnect Programmable Microwave Arrays

本研究的目标是解决通过低成本集成工艺实现高性能射频和微波集成电路的挑战。这种方法是基于预制的有源芯片的自组装，该芯片包含相同的微波晶体管和包含无源元件和互连金属化的衬底。该设计得益于严格的电磁仿真和复杂系统的非线性电路仿真，该复杂系统包含许多射频晶体管、3D互连线和无源元件。智能价值这项研究将研究自组装晶片级集成、用于复杂片上电磁分析的高容量计算电磁方法，以及线性电磁结构和非线性器件的高效联合仿真。将开发出一种精度优于200 nm的集成工艺，其晶体管触点面积为5？5？m。通过一种加速的时间域分层有限元降阶恢复算法，解决了电磁建模和仿真方面的问题。将设计、制造和测试工作频率从3 GHz到40 GHz的各种高性能微波收发机模块。更广泛的影响这个项目的更广泛的影响是提高我们设计和制造最先进的射频和微波产品的能力，使用简单和低成本的制造工艺。此外，PIS教授的两门研究生水平的课程将得到加强，方法是确定共同的项目，要求学生共同确定研究问题，并将其贯彻到射频系统制造和测试完成为止。

ObjectiveThe objective of this research is to address challenges in predictably implementing high performance RF and microwave integrated circuits through a low-cost integration process. The approach is based on self-assembly of prefabricated active chips containing identical microwave transistors and a substrate that contains passive components and interconnect metallization. The design benefits from rigorous EM simulations combined with non-linear circuit simulation of a complex system containing many RF transistors, 3D interconnect lines and passive components. Intellectual Merit The research will investigate self-assembled wafer-level integration, high capacity computational electromagnetic methods for complicated on-chip electromagnetic analysis, and efficient co-simulation of linear electromagnetic structures and non-linear devices. An integration process with better than 200nm accuracy with transistor contact pad area of 5?Êm?~5?Êm will be developed. Electromagnetic modeling and simulation aspects are addressed through an accelerated time-domain layered finite element reduction recovery algorithm. Various high performance blocks of microwave transceivers with operating frequencies ranging from 3 to 40 GHz will be designed, fabricated and tested. Broader ImpactThe broader impact of this project is to enhance our capability in designing and manufacturing state of the art RF and microwave products using a simple and low-cost manufacturing process. Additionally two graduate level courses taught by the PIs will be enhanced by defining common projects that require students to work together to define a research problem and follow it through until the RF system is fabricated and tested.