SBIR Phase I: Fault Isolation of Open Circuits in Semiconductor Products using Magnetic Current Imaging

这个小型企业创新研究第一阶段研究项目将扩展磁电流成像的能力，以检测半导体封装中的开路故障，精度为30微米，以促进半导体组件和器件集成到系统中。封装中遇到的最大、最困难的问题是由于前沿设计中不断增加的收缩和复杂技术而导致的电气开路。唯一可用的技术是具有1-2 mm的实际分辨率和耗时的逐层去处理的时域反射计。提出了使用磁电流成像与SQUID传感器来解决这一关键问题，通过增加设备的频率检测极限来检测缺陷位置处的高频信号。半导体行业迫切需要定位封装中的掩埋开放缺陷，分辨率低于30微米。所提出的技术的目标是30微米的分辨率，以填补已知的差距，故障隔离技术的包装。对于半导体公司来说，它将使封装制造工厂能够隔离开放性缺陷，并改进其制造工艺，以最大限度地减少或快速消除这些缺陷，从而使他们能够更快地将高质量可靠的产品推向市场。

This Small Business Innovation Research Phase I research project will extend the capabilities of magnetic current imaging to detect open failures in semiconductor packages with an accuracy of 30 microns to facilitate the integration of semiconductor components and devices into systems. The largest, most difficult problem encountered in packages is electrical opens due to increasing shrinking and complex technology in leading edge designs. The only available techniques are time domain reflectometry with practical resolution of 1-2 mm and time consuming layer-by-layer deprocessing. It is proposed to use magnetic current imaging with a SQUID sensor to solve this critical problem through increasing the frequency detection limit of the equipment to detect high frequency signals at the defect location.The semiconductor industry has a critical need for localization of buried open defects in packages with resolution below 30 microns. The proposed technology is targeting a 30 micron resolution to fill a known gap in fault isolation technology for packaging. For the semiconductor companies it will enable the packaging manufacturing sites to isolate open defects and improve their manufacturing processes to minimize or eliminate these defects quickly so that they can get high quality reliable products to market faster.