SBIR Phase II: Dry Thermal Adhesive Based on Carbon Nanotubes

这个小企业创新研究（SBIR）第二阶段项目旨在开发一种适用于科学，空间，工业和家庭使用的灵活，双面，干燥的粘合剂“胶带”。导热和导电带将是可拆卸的和可重复使用的，并且将不具有与其他粘合方法相关联的缺点。表面不需要光滑、清洁、无孔，也不需要铁磁性粘合剂，也不需要特殊固定装置进行连接。该项目将允许胶带直接用作任何两个表面之间的中间物，这两个表面需要1）从一个表面到另一个表面的高热传递，和/或2）强粘合。该项目将探索制造方面，以及生产具有上级热性能和粘合性能的双面胶带原型的准备工作。同时存在的机械、热和电性能使这种创新的胶带有利于许多应用，包括半导体芯片安装、散热和需要快速安装的系统。该项目的更广泛影响/商业潜力将意味着许多电子设备的热性能的显着改善，并通过消除螺栓固定（子）组件的需要节省制造时间。在上级性能、流线型设计、易于制造、无故障操作和简化组装方面，使用这种创新的真正商业价值可以在数百万美元的成本节省中运行。

This Small Business Innovation Research (SBIR) Phase II project seeks to develop a flexible, double-sided, dry adhesive "tape" that is applicable to science, space, industry and home use. The thermally and electrically conductive tape will be detachable and reusable, and, will not have the disadvantages associated with other adhesion methods. Surfaces will not require being smoothed, clean, non-porous, nor ferro-magnetic for adhesion, nor will it require special fixtures for attachment. This project will permit tape to be directly applied as the intermediary between any two surfaces that require 1) high thermal heat transfer from one surface to the other, and/or 2) strong adhesion. The project will explore manufacturing aspects, as well as preparation for production of prototype double-sided adhesive tape with superior thermal and adhesive properties. The coexistent mechanical, thermal and electrical properties, makes this innovative adhesive tape advantageous to many applications including semiconductor chip mounting, heat sinking and systems that require a rapid mount.The broader impact/commercial potential of this project will mean significant improvements in thermal performance of many electronic devices and time-savings in manufacturing by removing the need to bolt down (sub-) assemblies. The true commercial value of using this innovation, in terms of superior performance, streamlined designs, ease of manufacture, trouble-free operations and simplified assembly, could very well run in the millions of dollars in cost savings.