SBIR Phase II: Dry Thermal Adhesive Based on Carbon Nanotubes

这个小型企业创新研究 (SBIR) 第二阶段项目旨在开发一种适用于科学、太空、工业和家庭使用的柔性双面干胶“胶带”。导热导电胶带将是可拆卸和可重复使用的，并且不会具有与其他粘合方法相关的缺点。表面不需要光滑、干净、无孔、不需要铁磁性来粘合，也不需要特殊的固定装置来附着。该项目将允许将胶带直接用作任何两个表面之间的中介物，这些表面需要 1) 从一个表面到另一个表面的高热传递，和/或 2) 强粘合力。该项目将探索制造方面，以及为生产具有优异热性能和粘合性能的原型双面胶带做准备。共存的机械、热和电性能使这种创新的胶带有利于许多应用，包括半导体芯片安装、散热和需要快速安装的系统。该项目更广泛的影响/商业潜力将意味着许多电子设备的热性能得到显着改善，并且通过消除螺栓固定（子）组件的需要而节省制造时间。使用这项创新的真正商业价值，就卓越的性能、简化的设计、易于制造、无故障操作和简化的装配而言，很可能会节省数百万美元的成本。

This Small Business Innovation Research (SBIR) Phase II project seeks to develop a flexible, double-sided, dry adhesive "tape" that is applicable to science, space, industry and home use. The thermally and electrically conductive tape will be detachable and reusable, and, will not have the disadvantages associated with other adhesion methods. Surfaces will not require being smoothed, clean, non-porous, nor ferro-magnetic for adhesion, nor will it require special fixtures for attachment. This project will permit tape to be directly applied as the intermediary between any two surfaces that require 1) high thermal heat transfer from one surface to the other, and/or 2) strong adhesion. The project will explore manufacturing aspects, as well as preparation for production of prototype double-sided adhesive tape with superior thermal and adhesive properties. The coexistent mechanical, thermal and electrical properties, makes this innovative adhesive tape advantageous to many applications including semiconductor chip mounting, heat sinking and systems that require a rapid mount.The broader impact/commercial potential of this project will mean significant improvements in thermal performance of many electronic devices and time-savings in manufacturing by removing the need to bolt down (sub-) assemblies. The true commercial value of using this innovation, in terms of superior performance, streamlined designs, ease of manufacture, trouble-free operations and simplified assembly, could very well run in the millions of dollars in cost savings.