FOR 1660: Optical Design and Interconnection Technology for Assembly-Integrated Bus Systems

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As already planned at the beginning of the research group, the transition from a planar to a three-dimensional design of the optical bus system is to be investigated in the second funding period in order to increase the integration density even further and expand the design freedom of technical products. The resulting three-dimensional opto-mechatronic integrated devices (3D-Opto-MID) enable a combined mechanical, electrical and optical functionality and address a wide range of applications in the fields of automotive, aviation and industry 4.0. The goal of the second funding period is the realization of a three-dimensional transmission line with a bandwidth of more than 10 GBit / s (corresponds to 400 parallel 4K video signals). On the basis of the results of the first funding period, solutions for modeling, simulation, additive production and flexible coupling of waveguides on conditioned substrates in 3D are to be investigated over the next three years. From this task new scientific questions arise which, like in the first funding period, are adressed with exchange of expertise across locations:TP 1.2: How is it possible to condition a planar polymer substrate (i) by means of printing technology and (ii) beam processing technology while considering and compensating local distortions in such a way that applications of the optically functionalized foil on three-dimensional objects is provided?TP 2.2: How is it possible to generate high quality polymer optical waveguides by means of additive manufacturing on spatially curved surfaces?TP 3.2: How can printed polymer waveguides with optical functionalities be connected to three-dimensional surfaces by means of asymmetrical optical bus coupling, in order to achieve robust coupling results considering curved surfaces?TP 6.2: How can the geometric, functional and optical properties of polymer optical waveguides be (i) modeled and (ii) simulated on spatial objects, taking into account the manufacturing-related boundary conditions?