Measuring Thermomechanical Material Response During Micromachining by In Situ Scanning Electron Microscopy

通过原位扫描电子显微镜测量微加工过程中的热机械材料响应

• 批准号: 0856626
• 负责人: M Ravi Shankar
• 金额: $ 32.54万
• 依托单位: University of Pittsburgh
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2009
• 资助国家: 美国
• 起止时间: 2009-09-01 至 2014-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0856626&HistoricalAwards=false
• 关键词: Measuring; Thermomechanical; Material; Response; During

The objective of this research is to elucidate the deformation mechanics of chip formation in micromachining using in situ scanning electron microscopy. In this study, metal cutting will be performed on a customized sub-stage within the sample chamber of a scanning electron microscope in a configuration that enables direct visualization and characterization of the deformation zone in secondary and backscattered electron imaging modes. Subsequently, the mechanics of deformation will be delineated in situ through digital image correlation of sequences of secondary electron micrographs of the micromachining process. The microstructural consequences of micrometer-scale surface generation will be studied using electron backscattered diffraction techniques. Together, these characterizations can enable a detailed demarcation of the thermomechanical material response during material removal at small length-scales.If successful, this research may significantly enhance the current level of understanding of the micromachining process and possibly supplant the extant experimental paradigms which offer at best, a post-deformation, ex situ scheme entirely devoid of the dynamic details of the operative micromechanisms. It is envisioned that the interdisciplinary framework inherent to this research may offer unique opportunities for multi-faceted development of graduate students by bringing together elements of vacuum device design, quantitative electron microscopy as well as computational image processing methodologies. An impact on advancing undergraduate education is envisaged via integration with existing courses in manufacturing and creation of a new course aimed at seniors and juniors in the Industrial, Mechanical and Materials Science disciplines.

本研究的目的是阐明变形机制的芯片形成在微加工中使用原位扫描电子显微镜。在这项研究中，金属切割将在扫描电子显微镜的样品室内的定制子阶段进行，该配置使变形区在二次和背散射电子成像模式中直接可视化和表征。随后，变形机制将被描绘在原位通过数字图像相关的序列的二次电子显微照片的微加工过程。微米级表面生成的微观结构的后果将使用电子背散射衍射技术进行研究。总之，这些特征可以使详细划分的热机械材料的材料去除过程中的响应在小的长度scales.If成功的，这项研究可能会显着提高目前的水平的理解的微加工过程中，并可能取代现有的实验范式，提供最好的，变形后，异位计划完全没有的动态细节的操作微观mechanisms。据设想，这项研究所固有的跨学科框架可能会提供独特的机会，研究生的多方面发展，汇集真空器件设计，定量电子显微镜以及计算图像处理方法的元素。对推进本科教育的影响，设想通过与现有的制造业课程的整合，并创建一个新的课程，旨在在工业，机械和材料科学学科的大四学生和大三学生。