TC: Large: Collaborative Research: 3Dsec: Trustworthy System Security through 3-D Integrated Hardware

TC：大型：协作研究：3Dsec：通过 3D 集成硬件实现值得信赖的系统安全

• 批准号: 0910734
• 负责人: Theodore Huffmire
• 金额: $ 69.1万
• 依托单位: Naval Postgraduate School
• 依托单位国家: 美国
• 项目类别: Interagency Agreement
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-03-01 至 2015-02-28
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0910734&HistoricalAwards=false
• 关键词: TC; Large; Collaborative; Research; 3Dsec

While hardware resources for computation and data storage are now abundant, economic factors prevent specialized hardware security mechanisms from being integrated into commodity parts. System owners are caught between the need to exploit cheap, fast, commodity microprocessors and the need to ensure that critical security properties hold. This research will explore a novel way to augment commodity hardware after fabrication to enhance secure operation. The basic approach is to add a separate silicon layer, housing select security features, onto an existing integrated circuit. This 3-D Integration decouples the function and economics of security policy enforcement from the underlying computing hardware. As a result, security enhancements are manufacturing options applicable only to those systems that require them, which resolves the economic quandary. We plan to identify a minimal and realizable set of circuit-level security capabilities enabled by this approach, which can be judiciously controlled by the software layers. This will significantly assist in reducing both the software complexity often associated with security mechanisms and system vulnerabilities. This research introduces a fundamentally new method to incorporate security mechanisms into hardware and has the potential to significantly shift the economics of trustworthy systems. A broader impact will result through collaborative and educational activities. Graduate and undergraduate student research associates will transfer knowledge to future teachers, researchers and Information Assurance professionals; and project publications will provide direct technical transfer to the embedded-systems and hardware-design communities.

虽然用于计算和数据存储的硬件资源现在很丰富， 经济因素阻止了专门的硬件安全机制 集成到商品部件中。系统所有者被夹在需要利用 廉价，快速，商品微处理器和需要确保关键的安全性 财产持有。 这项研究将探索一种新的方式来增加商品硬件后，制造 以加强安全操作。基本的方法是添加单独的硅层， 将选择的安全特征封装到现有的集成电路上。这种三维集成 将安全策略实施的功能和经济性从 底层计算硬件。因此，安全增强是制造业 选项仅适用于需要它们的系统， 经济困境。我们计划确定一个最小的和可实现的电路级 通过这种方法实现的安全功能，可以通过 软件层。这将大大有助于降低软件复杂性 通常与安全机制和系统漏洞有关。 这项研究引入了一种全新的方法， 机制转化为硬件，并有可能显著改变 可靠的系统更广泛的影响将通过合作和教育产生 活动研究生和本科生研究助理将转移 为未来的教师、研究人员和信息保障专业人员提供知识; 项目出版物将为嵌入式系统提供直接的技术转让 和硬件设计社区。