CAREER: Transcending the Thermal Management Challenges of Tera-Scale Computing

职业生涯：克服万亿级计算的热管理挑战

• 批准号: 0952866
• 负责人: Sherief Reda
• 金额: $ 42.7万
• 依托单位: Brown University
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-02-01 至 2016-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0952866&HistoricalAwards=false
• 关键词: CAREER; Transcending; Thermal; Management; Challenges

Elevated temperature is a major problem for the reliability, performance, power consumption, and packaging costs of integrated electronic devices. Temperature is a main physical barrier limiting the performance benefits of future technologies that promise tera-scale integration. To meet the thermal management challenges of future many-core processors, this research program envisions a new class of intelligent dynamic thermal management systems that explore the vast search space of possible control parameter settings and decide the optimal temperature and performance targets. This research program also investigates new cooling system designs that enable the thermal management system to target directly hot spots at the micro scale. Directly targeting hot spots alleviates the thermal constraints on performance.The proposed research program will lead to transformative solutions and tools that address the fundamental thermal management challenges of computing systems and ensure their scalability. The proposed program will lead to the training of a diverse workforce of undergraduate and graduate students to be well prepared to deal with tomorrow?s thermal management challenges. The educational component of this program includes (1) research experiences for undergraduates; (2) integrated approach to entrepreneurship education with research; (3) hands-on training through the development of educational laboratories based on a state-of-the-art infrared camera; and (4) continuous education through the development of high-quality educational materials and an interactive technical Web site.

温度升高是影响集成电子设备可靠性、性能、功耗和封装成本的主要问题。温度是限制未来有望实现万亿级集成的技术的性能优势的主要物理障碍。为了应对未来多核处理器的热管理挑战，该研究计划设想了一类新的智能动态热管理系统，该系统探索可能的控制参数设置的巨大搜索空间，并确定最佳温度和性能目标。这项研究计划还研究了新的冷却系统设计，使热管理系统能够直接针对微观范围的热点。直接瞄准热点可以缓解性能上的热约束。拟议的研究计划将带来变革性的解决方案和工具，以解决计算系统的基本热管理挑战，并确保其可扩展性。拟议的计划将导致培养多样化的本科生和研究生队伍，为应对未来的S热力管理挑战做好准备。该计划的教育部分包括：(1)本科生的研究经验；(2)创业教育与研究相结合的方法；(3)通过开发基于最先进的红外摄像机的教育实验室进行动手培训；以及(4)通过开发高质量的教育材料和互动技术网站进行继续教育。