CAREER: Transcending the Thermal Management Challenges of Tera-Scale Computing

职业生涯：克服万亿级计算的热管理挑战

• 批准号: 0952866
• 负责人: Sherief Reda
• 金额: $ 42.7万
• 依托单位: Brown University
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-02-01 至 2016-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0952866&HistoricalAwards=false
• 关键词: CAREER; Transcending; Thermal; Management; Challenges

Elevated temperature is a major problem for the reliability, performance, power consumption, and packaging costs of integrated electronic devices. Temperature is a main physical barrier limiting the performance benefits of future technologies that promise tera-scale integration. To meet the thermal management challenges of future many-core processors, this research program envisions a new class of intelligent dynamic thermal management systems that explore the vast search space of possible control parameter settings and decide the optimal temperature and performance targets. This research program also investigates new cooling system designs that enable the thermal management system to target directly hot spots at the micro scale. Directly targeting hot spots alleviates the thermal constraints on performance.The proposed research program will lead to transformative solutions and tools that address the fundamental thermal management challenges of computing systems and ensure their scalability. The proposed program will lead to the training of a diverse workforce of undergraduate and graduate students to be well prepared to deal with tomorrow?s thermal management challenges. The educational component of this program includes (1) research experiences for undergraduates; (2) integrated approach to entrepreneurship education with research; (3) hands-on training through the development of educational laboratories based on a state-of-the-art infrared camera; and (4) continuous education through the development of high-quality educational materials and an interactive technical Web site.

温度升高是集成电子设备的可靠性，性能，功耗和包装成本的主要问题。温度是一个主要的物理障碍，限制了承诺将未来技术集成的未来技术的性能优势。为了满足未来多核处理器的热管理挑战，该研究计划设想了一类新的智能动态热管理系统，该系统探讨了可能的控制参数设置的庞大搜索空间，并确定最佳温度和性能目标。该研究计划还研究了新的冷却系统设计，使热管理系统能够以微型尺度为目标。直接针对热点可以减轻对性能的热约束。拟议的研究计划将导致解决方案和工具，以应对计算系统的基本热管理挑战并确保其可扩展性。拟议的计划将导致培训本科生和研究生各种各样的劳动力，以充分准备应对明天的热门管理挑战。该计划的教育部分包括（1）本科生的研究经验； （2）通过研究进行综合的企业家教育方法； （3）通过基于最先进的红外摄像头开发教育实验室的实践培训； （4）通过开发高质量的教育材料和交互式技术网站的持续教育。